About IICIE 2026

International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the entire ecosystem across chip & IC design, semiconductor manufacturing, packaging & testing equipment, core parts and materials.
IICIE 2026 brings together professionals from IDM, Fabless, Fab, OSAT, as well as automotive, AI, consumer electronics, communications & computing, and optoelectronics, driving innovation, accelerating industry cooperation, and empowering your business growth.

Time: September 10-12, 2025

Venue: Shenzhen World Exhibition and Convention Center, China

Why Attend IICIE 2026?

• Building a Comprehensive Semiconductor Ecosystem
  Gathering the entire semiconductor value chain, industry leaders, key enterprise representatives and experts, facilitating in-depth collaboration across upstream and downstream sectors, covering the full ecosystem from chip & IC design, semiconductor manufacturing, packaging & testing equipment, materials and parts.
• Unlock Massive Demand in China’s Semiconductor Industry
  As the world’s largest markets for semiconductor applications, China offers robust demand from wafer fabrication and advanced equipment to materials, packaging & testing, the market continues to seek solutions that close capability gaps and improve production performance. At the same time, the country continues to expand its downstream application base in consumer electronics, computing, automotive electronics, and digital infrastructure. This is a prime time for exhibitors and visitors to build brand awareness, expand business networks, and explore cross-border cooperation at IICIE 2026.
• 20+ High-Level Concurrent Conferences Unlock Strategic Insights
  Join 20+ concurrent conferences, including key sessions on Chip and Chip Application, Semiconductor Manufacturing, Advanced Packaging and Testing, Compound Semiconductor, Intelligent Manufacturing, and Green Facilities Management, etc. Through keynote speeches, technical exchanges, project matchmaking, the expo will comprehensively facilitate IC industry resource integration and innovative collaboration.
• 340,000 sqm Co-located Events Fostering Cross-Industry Collaboration
  IICIE 2026 will be co-located with the 27th China International Optoelectronic Exposition (CIOE 2026) and Shenzhen International Electronics & Embedded Expo (elexcon 2026), forming a 340,000 sqm mega exhibition with over 5,000 exhibitors and 240,000 professional visitors. This integrated platform connects integrated circuits with optoelectronics and electronics & embedded systems, enabling cross-industry collaboration and creating a one-stop ecosystem for innovation and application development.

Exhibit Profile

Chip

AI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc.

IC Design / Manufacturing Service

IP/EDA (Electronic Design Automation), fabless, foundry, OSAT (Outsourced Semiconductor Assembly and Testing), testing services, etc.

Semiconductor Equipment

manufacturing equipment, packaging equipment, inspection and test equipment, assembly equipment, environmental control equipment, factory automation / robot, etc.

Semiconductor Material

substrate material, manufacturing material, packaging material, etc.

Semiconductor Core Parts

sealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc.

Compound Semiconductor & Power Device

Silicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.

Key Visiting Companies

• EDA/IP
  ACTT, EMPYREAN, HCHIPLET SEMICONDUCTOR, PRIMARIUS, RONG SEMICONDUCTOR, SEMITRONIX, SICHIP, SIEMENS EDA, SPLENDOR, SYNOPSYS, UNIVISTA, XPEEDIC...
• Fabless & IDM
  BASIC SEMICONDUCTOR, BIWIN, BYD, C*CORE, CHIPON MICROELECTRONICS, CHIPPACKING, CXMT, DOSILICON, ELLON , EVERBRIGHT, FINE MADE MICRO, GEEHY, GOOGLE, GOERMICRO, GOODIX, GUOXIN MICRO, HANWEI ELECTRONICS, HISILICON, IBM, INTELLIFUSION, KAIFA, LONGSYS, NSING, NVIDIA, SANAN OPTOELECTRONICS, SANECHIPS, SGKS, SIGMASTAR, SILAN, SONY, STARFIVE, STMICROELECTRONICS, STS, UNISOC, VALEO, VIMICRO...
• Foundry
  CR MICRO, GLOBALFOUNDRIES, HUAHONG, NEXCHIP, SAMSUNG FOUNDRY, SMIC, HLMC, TOWER SEMICONDUCTOR, PENGXINWEI...
• OSAT
  BLUE ROCKET ELECTRONICS, CAPCON, CHIPMORE, CHIPPACKING, FHEC, GUANGDONG 3D-SEMI, HISEMI, HT-TECH, JCET, KAIFA, LEADYO, NCAP CHINA, SHENGYUAN SEMICONDUCTOR, SINOIC, SJ SEMI, TIANCHENG, TONGFU MICROELECTRONICS, UNIONSEMICON, V-TEST, WISE ROAD CAPITAL, WLCSP, YUNTIAN...
• Semiconductor Equipment
  AFILM, AIT, ALLSEMI, ASPIRING, CCTECH, CETC 13 , CETC 45 , CHOTEST, DJEL, DREAM LAUNCH, FMSH, GLOBALFOUNDRIES, HAYUE SEMICONDUCTOR , HSET, HUATUO SEMICONDUCTOR , HUAV, HWATSING , HYMSON, KINGSEMI, LEIBOSEMI, LIANDE, MACROTEST SEMICONDUCTOR TECHNOLOGY, MAGIC-RAY, MAXWELL, MINTEST, MOSART , MQL, NASO TECH, NEXCHIP, S.C NEW ENERGY TECHNOLOGY, SIDEA, SKYVERSE, SUNNY INSTRUMENTS, TAIYAN SEMI EQUIPMENT, T-VISION, XINYICHANG TECHNOLOGY, YUWEITEK, ZHENGYE TECHNOLOGY, ZHIZHENG HOLDING...
• Semiconductor Material
  ANCHUTECH, CCTC, DINGLONG, ESWIN, GEMCH, GRIKIN, HUALUN CHEMICAL, HUATE GAS, JINGJIUMC, KFMI, LUYUANSCI & TECH, MITSUI HIGH-TEC, NATA OPTO-ELECTRONIC MATERIAL, NEWWAY, PERIC, QINGYI, RONGDA, SINOPACK ELECTRONIC, SINYANG SEMICONDUCTOR, SQ GROUP, SUNTIFIC, SYTECH, TDG, WANHUA CHEMICAL, YIXIN SEMICONDUCTOR, ZHONGWEI LIHE...
• Semiconductor Core Parts
  AMS, BWT, COHERENT, FORTUNE PRECISION, GENTECH, GLOBAL TECHNOLOGY, GZ PHOTONICS, HANBELL, INNO LASER, JIENUOTE, KFMI, KINGLAI, KSTAR, MLOPTIC, OFILM, SCHAEFFLER, SHIJIA PHOTONS, TZTEK, U-PRECISION, VITAL MATERIALS...
• Compound Semiconductor
  PUSHING, CCMC, DOGAIN, ICEMOS, PURECHIP, SICC, TANKEBLUE, ZINGSEMI...
• Power Semiconductor
  AST, ASCENPOWER, BELLING, INVSEMI, INVT, JJMICROELECTRONICS, MITSUBISHIELECTRIC, MURATA, NEXPERIA, TBEA, UNIMICRON, WEEN SEMICONDUCTORS...
• Sensors
  EZVIZ, HESAI, HUALIAN ELECTRONICS, LENS TECHNOLOGY, OMRON, RAPHAEL OPTECH, RAYTRON, SENSYLINK...
• Intelligent Equipment
  AUTOWELL, BOZHON, CHUANYI, EMERSON, GOOGOLTECH, HCFA, HEYAN, INNO LASER, JAFENG AUTOMATION, KAIJO, KERUIDA, KEYENCE, LEAD, NASO TECH, NCEPOWER, NEXTOOL, OPT, OPT, SINEVA, SISCANTECH, TENSUN, TORCH, TZTEK, YAMAHA, YITOA, ZC OPTOELECTRONIC , ZHAOYANG SUNSHINE TECHNOLOGY...
• Industrial Robot
  ASTRIBOT, EAVISION, ELITE ROBOTOS, FANUC, LEADSHINE, MEGAROBO, MEGMEET, SCHNEIDER ELECTRIC, SIASUN, STEP, TOPSTAR, UBTECH...
• Printed Circuit Board Manufacturing / Assembly
  ASUS, AVARY HOLDING, FASTPRINT, KINWONG, LUXSHARE, MANKUN TECHNOLOGY, MFS TECHNOLOGY, RAYTRONS, RED BOARD, SCC, SIHUI FUJI ELECTRONICS, UNIMICRON TECHNOLOGY...
• Display
  BOE, HONGLI ZHIHUI, HORION, INNOLUX, JCOPTIX, JEZETEK, KONKA, LEYARD, LIGHTNING OPTOELECTRONIC, MLS, NATIONSTAR, OKTECH, REFOND, TCL CSOT, UNILUMIN, WOLFSPEED, XINGYU...
• New Energy
  BAK, CGN, DESAY, HUAWEI DIGITAL POWER, INNER MONGOLIA PHOTONICS TECHNOLOGIES, JA SOLAR, SUNWODA, TBEA...
• Computing & Communications
  ALIBABA CLOUD, BAIDU, BYTEDANCE, CHINA MOBILE, CHINA TELECOM, CHINA UNICOM, DIGITAL CHINA, FIBOCOM, HUAWEI, INSPUR, JD, MEITUAN, OFIDE, QUECTEL, TENCENT, ZTE...
• Optoelectronics
  ACCELINK, AFR, APPOTRONICS, C-DATA, ELSTECH, EOPTOLINK, EVERPROX, FINISAR, HI-OPTEL TECHNOLOGY, HISENSE, HISILICON, O-NET, OPLINK COMMUNICATIONS, OPTOWIDE, PHOENIX TELECOM TECHNOLOGY, PHOTONX TECHNOLOGY, RAYCUSLASER, SDGI, SOURCE PHOTONICS, TFC, TRIPLE-STONE, XHB ELECTRONICS TECHNOLOGY, YTOT, ZHONGJI INNOLIGHT...
• Automotive
  BAOLONG, BMW, BYD, DENSO, DESAY SV, GAC TOYOTA, NIO, SAIC, SGMW, UAEE, XINJIE'AN, ZEEKR...
• Consumer Electronics
  CHINASOFT INTERNATIONAL, DELTA, DJI, ECOVACS, EMDOOR, GOOVIS, HISENSE, HSAE, HUAWEI, IFLYTEK, INSTA360, JD, LITTLE GENIUS, LLVISION, LONGCHEER, MAGIC LEAP, MIDEA, NOKIA, OPPO, ORVIBO, ROIDMI, SENNHEISER, SHENHAO TECHNOLOGY, TCL, TRANSSION, VIVO, WELLRUN TECHNOLOGY, XIAOMI...
• University / Research Institute
  BIT, BJUT, BUAA, CAEP-IEE, CAS GDAS, CAS-CIOMP, CAS-SIAT, CAS-XIOPM, CEPREI, FDU, GDUT, HIT, HUST, IME CAS, IOP CAS, IS CAS, JHL, JNU, PKU, SCUT, SIOM, SUSTECH, SZU, THU, TJU, WHU, XMU, ZJU...

Concurrent Conferences

Effectively Prepared

Take a Booth

Traffic Guide

Letter for Visa

Conference List

Hotel Reservation

Floor Plan