About IICIE 2026
As a premier platform for the semiconductor industry, the International Integrated Circuit Innovation Expo (IICIE 2026) showcases the entire ecosystem across chip & IC design, semiconductor manufacturing, packaging & testing equipment, core parts and material. It will take place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
We cordially invite professionals from IDM, fabless, fab, OSAT, as well as leaders from the automotive, AI, consumer electronics, communications & computing, optoelectronics and many more sectors to join us. IICIE offers an ideal platform to drive innovation, accelerate industry cooperation, and empower your business growth.
Time: September 9-11, 2026
Venue: Shenzhen World Exhibition and Convention Center, China
Exhibition Area(sqm)
Exhibitors
Professional Visitors
Conferences
Why Visit IICIE 2026?
- Full‑Spectrum Semiconductor Ecosystem
Explore innovations spanning chip & IC design, wafer fabrication, OSAT, semiconductor material, equipment and core parts. Discover emerging technologies driving next‑generation AI, automotive electronics, and high‑performance computing(HPC) applications. - China’s Massive Demand for Advanced Solutions
Driven by strong demand from wafer fabs, equipment manufacturers, and leading downstream players in consumer electronics and automotive sectors, IICIE 2026 serves as the pivotal platform for technologies that enhance production yields, reduce operational costs, and accelerate time-to-market. - 20+ Technical Conferences & Application-Focused Forums
Participate in concurrent conferences covering hot topics including advanced packaging, compound semiconductor, intelligent manufacturing, and more. These sessions bridge the gap between R&D breakthroughs and scalable commercial deployment. - Co-located with CIOE and elexcon
In 2026, IICIE will be co-located with CIOE – China International Optoelectronics Expo and elexcon - Shenzhen International Electronics & Embedded Expo to create a more comprehensive, open and collaborative industrial ecosystem. Together, these exhibitions will build a “Chips + Core Devices + Equipment & Solutions” full-industry-chain platform that unlocks unprecedented cross-sector collaboration opportunities.
Featured Halls
Chip / IC Design, Semiconductor Packaging and Testing Hall
- IC chip, design / electronic design, automation services (EDA & IP), outsourced semiconductor assembly and testing services (OSAT), packaging & testing equipment, packaging materials and consumable / core parts
IC Fabrication Hall
- IC fabrication & foundry, IC manufacturing equipment, metrology equipment, substrate & manufacturing material & consumable, core parts
Compound Semiconductor Hall
- power device and module, material and substrate, manufacturing equipment, packaging and testing equipment, core parts
Exhibit Profile
Chip 
IC Design / Manufacturing Service 
Semiconductor Equipment 
Semiconductor Material 
Semiconductor Core Parts 
Compound Semiconductor & Power Device Featured Zones
- Chip Application Zone
Showcasing automotive electronics, HPC, and smart wearables, this zone connects chip suppliers, solution providers and terminal developers to facilitate business matching. Onsite product demonstrations and technical sessions will demonstrate the integration of AI computing with automotive, wearable, and high-performance computing scenarios.
- RISC-V Ecosystem Zone
Focusing on open-source architecture, HW/SW co-design and full-stack implementation, this zone displays a comprehensive RISC-V ecosystem spanning IP, processor, operating system and applications for AI, automotive, industrial, and data center. It presents a one-stop showcase of how open-source chips drive edge-cloud integrated computing, automotive chip and edge AI, creating new possibilities for intelligent computing.
Premium Forums
Attend 20+ concurrent conferences featuring global industry leaders, technical experts, and academic pioneers. Explore frontier trends in IC design, advanced packaging & testing, manufacturing, and intelligent systems while connecting with key stakeholders across the entire semiconductor ecosystem.
Onsite Programs to Streamline Your Visit
At IICIE 2026, we prioritize your productivity with tailored onsite programs designed to transform your visit into high-impact business results.
- VIP Buyer Program
Exclusively designed for senior semiconductor industry buyers and decision-makers with active procurement plans, this program offers personalized one-on-one business matchmaking, pre-scheduled buyer-exhibitor meetings, and VIP lounge access—all designed to streamline your sourcing process and drive high-value collaborations.
>> Learn More
- Delegation Group Program
Groups of three or more participants will enjoy a fully coordinated visit experience. No individual registration is required—simply provide your delegation members' details to our team, and we will handle all registration procedures on your behalf. Benefits include exclusive welcome gifts, curated visit guides, and priority business matchmaking at the VIP Lounge. Perfect for corporate teams or industry alliances seeking to maximize visit outcomes and foster team collaboration. >> Learn More
Co-located Events
IICIE 2026 will be co-located with the 27th China International Optoelectronic Exposition (CIOE 2026) and Shenzhen International Electronics & Embedded Expo (elexcon 2026), creating a 340,000-sqm mega platform that brings together over 5,000 exhibitors and 240,000 professional visitors.
This unique convergence creates a comprehensive ecosystem spanning semiconductor - optoelectronic - embedded electronic systems, enabling unprecedented cross-industry collaboration and one-stop access to the entire industrial value chain.
- CIOE 2026
It covers the complete optoelectronics ecosystem through 8 featured expos including information and communication, precision optics, laser, infrared, sensing, display, AR & VR, photonic innovation, and more. 
- elexcon 2026
The event showcases cutting-edge electronics and embedded technologies, spotlighting embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, industrial power supplies, passive components, advanced packaging, and more. 
Effectively Prepared
Contact Us
Shenzhen Herong Zhongxin Exhibition Co., Ltd.
Tel：+86-0755-88242545 (Working Hour: Mon - Fri 8:30 - 17:30)
Fax：+86-0755-88242599
E-mail：Info.iicie@informa.com