The global semiconductor industry is undergoing profound restructuring and technological innovation. Chips form the backbone of information technology, supporting strategic industries including AI, new energy vehicles and industrial internet. Nevertheless, China’s chip design sector faces major hurdles: gaps in high-end chip technology, reliance on imported IP and EDA tools, fragmented industrial chains and low conversion rates of research achievements.

Under such circumstances, the journal Chip hosts the Chip Design Forum. This platform brings together industry participants to discuss core technological breakthroughs, industrial coordination and talent training. It facilitates technical innovation and industrial integration, boosting high-quality development of China’s chip industry.

Conference Tracks:

ØHeterogeneous Integration & Chiplet Design

Ø AI Chip Design and Architecture Innovation Forum

Ø Safety Design of Automotive-Grade Chips

Ø Design of Low-Power Edge Chips

Ø Co-Design of Chips for Design-Manufacturing Collaboration

Ø Data Center Computing Chip Design & Optoelectronic Collaborative Optimization