The global silicon photonics chip market is expected to exceed USD 8 billion by 2028, with a compound annual growth rate of more than 30%. LightCounting forecasts that, by 2030, silicon photonics chips will account for 60% of the optical communication chip market.

Silicon photonics is a key breakthrough area for the optoelectronic integration industry, while manufacturing, packaging and testing are the core supports for large-scale commercialization. CPO (Co-Packaged Optics) integrates optical engines with switch chips and AI chips in the same package to enable high-speed, low-power data transmission. At the same time, advances in Chiplet, glass substrates, advanced bonding, 2.5D/3D packaging and EDA collaborative design are also driving optoelectronic heterogeneous integration from single-device innovation toward system-level innovation.

The summit focuses on the full process of silicon photonics manufacturing, packaging and testing. It will invite senior executives from core companies across the industrial chain, analysts and authoritative experts to discuss key stages such as front-end process adaptation, mid-end foundry optimization and back-end packaging innovation. The summit will explore technical challenges, process collaboration and supply chain planning, support the scaled production of silicon photonics chips and modules in the AI era, and examine new technology routes and industrial ecosystems in the age of optoelectronic convergence. 

Suggested Topics:

➢  Latest breakthroughs in silicon photonics chip design and manufacturing

➢  From process bottlenecks to breakthroughs in domestically developed equipment

➢  Challenges and opportunities in industrial chain collaboration and scaled production

➢  Photonic integrated circuits and chip design automation (EDA)

➢  Wafer manufacturing for silicon photonics chips

➢  Chip processes and tape-out platforms

➢  Process collaboration and supply chain planning

➢  CPO trends and diversified technology routes

➢  Breakthroughs in core processes for heterogeneous integration

➢  Full-process CPO toolchain and design innovation

➢  Key technologies for silicon photonics and optical engines

➢  Scaled manufacturing and testing of CPO

➢  Hybrid bonding driving innovation in optoelectronic convergence packaging

➢  Optical I/O technology routes and industrialization progress