The global silicon photonics chip market size is projected to exceed US$8 billion by 2028, with a compound annual growth rate (CAGR) of over 30%. According to forecasts by LightCounting, silicon photonics chips will account for 60% of the optical communication chip market by 2030.

Silicon photonics technology represents a core breakthrough for the optoelectronic integration industry, while manufacturing and packaging & testing serve as pivotal underpinnings for its large-scale commercial deployment. Co-packaged Optics (CPO) integrates optical engines with switch chips and AI chips within a single package to deliver high-speed, low-power data transmission. Meanwhile, advances in Chiplet technology, glass substrates, advanced bonding, 2.5D/3D packaging, and collaborative EDA design are driving optoelectronic heterogeneous integration from discrete component innovation toward system-level breakthroughs.

This summit centers on the full manufacturing and packaging-testing workflow of silicon photonics. It gathers senior executives from upstream and downstream core industrial chain enterprises, industry analysts and authoritative specialists to conduct in-depth discussions on technical bottlenecks, process coordination and supply chain layout covering key segments including front-end process adaptation, mid-stream foundry optimization and back-end packaging innovation. The event aims to facilitate mass production of silicon photonics chips and modules amid the AI era, and explore new technical roadmaps and industrial ecosystems under the wave of optoelectronic convergence.

Reference Topics:

• Ø Latest Breakthroughs in Silicon Photonics Chip Design and Manufacturing

• Ø From Process Bottlenecks to Breakthroughs in Domestic Equipment Localization

• Ø Challenges and Opportunities of Industrial Chain Collaboration & Mass Production

• Ø Photonic Integrated Circuits (PICs) and Electronic Design Automation (EDA)

• Ø Silicon Photonics Chip Wafer Fabrication

• Ø Chip Processes and Tape-out Platforms

• Ø Process Coordination and Supply Chain Layout Planning

• Ø CPO Trends and Diverse Technical Routes

• Ø Core Process Breakthroughs for Heterogeneous Integration

• Ø Full-process Toolchains and Design Innovations for Co-Packaged Optics (CPO)

• Ø Key Technologies of Silicon Photonics and Optical Engines

• Ø Mass Manufacturing and Testing of CPO Products

• Ø Hybrid Bonding Enabling Innovative Optoelectronic Convergence Packaging

• Ø Technical Routes and Industrialization Progress of Optical I/O