International Integrated Circuit Innovation Exposition ( IICIE 2027 )

Visiting Companies

EDA/IP
ACTT, EMPYREAN, HCHIPLET SEMICONDUCTOR, PRIMARIUS, RONG SEMICONDUCTOR, SEMITRONIX, SICHIP, SIEMENS EDA, SPLENDOR, SYNOPSYS, UNIVISTA, XPEEDIC...
Fabless & IDM
BASIC SEMICONDUCTOR, BIWIN, BYD, C*CORE, CHIPON MICROELECTRONICS, CHIPPACKING, CXMT, DOSILICON, ELLON , EVERBRIGHT, FINE MADE MICRO, GEEHY, GOOGLE, GOERMICRO, GOODIX, GUOXIN MICRO, HANWEI ELECTRONICS, HISILICON, IBM, INTELLIFUSION, KAIFA, LONGSYS, NSING, NVIDIA, SANAN OPTOELECTRONICS, SANECHIPS, SGKS, SIGMASTAR, SILAN, SONY, STARFIVE, STMICROELECTRONICS, STS, UNISOC, VALEO, VIMICRO...
Foundry
CR MICRO, GLOBALFOUNDRIES, HUAHONG, NEXCHIP, SAMSUNG FOUNDRY, SMIC, HLMC, TOWER SEMICONDUCTOR, PENGXINWEI...
OSAT
BLUE ROCKET ELECTRONICS, CAPCON, CHIPMORE, CHIPPACKING, FHEC, GUANGDONG 3D-SEMI, HISEMI, HT-TECH, JCET, KAIFA, LEADYO, NCAP CHINA, SHENGYUAN SEMICONDUCTOR, SINOIC, SJ SEMI, TIANCHENG, TONGFU MICROELECTRONICS, UNIONSEMICON, V-TEST, WISE ROAD CAPITAL, WLCSP, YUNTIAN...
Semiconductor Equipment
AFILM, AIT, ALLSEMI, ASPIRING, CCTECH, CETC 13 , CETC 45 , CHOTEST, DJEL, DREAM LAUNCH, FMSH, GLOBALFOUNDRIES, HAYUE SEMICONDUCTOR , HSET, HUATUO SEMICONDUCTOR , HUAV, HWATSING , HYMSON, KINGSEMI, LEIBOSEMI, LIANDE, MACROTEST SEMICONDUCTOR TECHNOLOGY, MAGIC-RAY, MAXWELL, MINTEST, MOSART , MQL, NASO TECH, NEXCHIP, S.C NEW ENERGY TECHNOLOGY, SIDEA, SKYVERSE, SUNNY INSTRUMENTS, TAIYAN SEMI EQUIPMENT, T-VISION, XINYICHANG TECHNOLOGY, YUWEITEK, ZHENGYE TECHNOLOGY, ZHIZHENG HOLDING...
Semiconductor Material
ANCHUTECH, CCTC, DINGLONG, ESWIN, GEMCH, GRIKIN, HUALUN CHEMICAL, HUATE GAS, JINGJIUMC, KFMI, LUYUANSCI & TECH, MITSUI HIGH-TEC, NATA OPTO-ELECTRONIC MATERIAL, NEWWAY, PERIC, QINGYI, RONGDA, SINOPACK ELECTRONIC, SINYANG SEMICONDUCTOR, SQ GROUP, SUNTIFIC, SYTECH, TDG, WANHUA CHEMICAL, YIXIN SEMICONDUCTOR, ZHONGWEI LIHE...
Semiconductor Core Parts
AMS, BWT, COHERENT, FORTUNE PRECISION, GENTECH, GLOBAL TECHNOLOGY, GZ PHOTONICS, HANBELL, INNO LASER, JIENUOTE, KFMI, KINGLAI, KSTAR, MLOPTIC, OFILM, SCHAEFFLER, SHIJIA PHOTONS, TZTEK, U-PRECISION, VITAL MATERIALS...
Compound Semiconductor
PUSHING, CCMC, DOGAIN, ICEMOS, PURECHIP, SICC, TANKEBLUE, ZINGSEMI...
Power Semiconductor
AST, ASCENPOWER, BELLING, INVSEMI, INVT, JJMICROELECTRONICS, MITSUBISHIELECTRIC, MURATA, NEXPERIA, TBEA, UNIMICRON, WEEN SEMICONDUCTORS...
Sensors
EZVIZ, HESAI, HUALIAN ELECTRONICS, LENS TECHNOLOGY, OMRON, RAPHAEL OPTECH, RAYTRON, SENSYLINK...
Intelligent Equipment
AUTOWELL, BOZHON, CHUANYI, EMERSON, GOOGOLTECH, HCFA, HEYAN, INNO LASER, JAFENG AUTOMATION, KAIJO, KERUIDA, KEYENCE, LEAD, NASO TECH, NCEPOWER, NEXTOOL, OPT, OPT, SINEVA, SISCANTECH, TENSUN, TORCH, TZTEK, YAMAHA, YITOA, ZC OPTOELECTRONIC , ZHAOYANG SUNSHINE TECHNOLOGY...
Industrial Robot
ASTRIBOT, EAVISION, ELITE ROBOTOS, FANUC, LEADSHINE, MEGAROBO, MEGMEET, SCHNEIDER ELECTRIC, SIASUN, STEP, TOPSTAR, UBTECH...
Printed Circuit Board Manufacturing / Assembly
ASUS, AVARY HOLDING, FASTPRINT, KINWONG, LUXSHARE, MANKUN TECHNOLOGY, MFS TECHNOLOGY, RAYTRONS, RED BOARD, SCC, SIHUI FUJI ELECTRONICS, UNIMICRON TECHNOLOGY...
Display
BOE, HONGLI ZHIHUI, HORION, INNOLUX, JCOPTIX, JEZETEK, KONKA, LEYARD, LIGHTNING OPTOELECTRONIC, MLS, NATIONSTAR, OKTECH, REFOND, TCL CSOT, UNILUMIN, WOLFSPEED, XINGYU...
New Energy
BAK, CGN, DESAY, HUAWEI DIGITAL POWER, INNER MONGOLIA PHOTONICS TECHNOLOGIES, JA SOLAR, SUNWODA, TBEA...
Computing & Communications
ALIBABA CLOUD, BAIDU, BYTEDANCE, CHINA MOBILE, CHINA TELECOM, CHINA UNICOM, DIGITAL CHINA, FIBOCOM, HUAWEI, INSPUR, JD, MEITUAN, OFIDE, QUECTEL, TENCENT, ZTE...
Optoelectronics
ACCELINK, AFR, APPOTRONICS, C-DATA, ELSTECH, EOPTOLINK, EVERPROX, FINISAR, HI-OPTEL TECHNOLOGY, HISENSE, HISILICON, O-NET, OPLINK COMMUNICATIONS, OPTOWIDE, PHOENIX TELECOM TECHNOLOGY, PHOTONX TECHNOLOGY, RAYCUSLASER, SDGI, SOURCE PHOTONICS, TFC, TRIPLE-STONE, XHB ELECTRONICS TECHNOLOGY, YTOT, ZHONGJI INNOLIGHT...
Automotive
BAOLONG, BMW, BYD, DENSO, DESAY SV, GAC TOYOTA, NIO, SAIC, SGMW, UAEE, XINJIE'AN, ZEEKR...
Consumer Electronics
CHINASOFT INTERNATIONAL, DELTA, DJI, ECOVACS, EMDOOR, GOOVIS, HISENSE, HSAE, HUAWEI, IFLYTEK, INSTA360, JD, LITTLE GENIUS, LLVISION, LONGCHEER, MAGIC LEAP, MIDEA, NOKIA, OPPO, ORVIBO, ROIDMI, SENNHEISER, SHENHAO TECHNOLOGY, TCL, TRANSSION, VIVO, WELLRUN TECHNOLOGY, XIAOMI...
University / Research Institute
BIT, BJUT, BUAA, CAEP-IEE, CAS GDAS, CAS-CIOMP, CAS-SIAT, CAS-XIOPM, CEPREI, FDU, GDUT, HIT, HUST, IME CAS, IOP CAS, IS CAS, JHL, JNU, PKU, SCUT, SIOM, SUSTECH, SZU, THU, TJU, WHU, XMU, ZJU...

AI chip, communication chip, memory chip, CPU chip, sensor chip, analog chip, digital chip, power management and power chip, RF chip, driver chip, etc.

EDA / IP (electronic design automation), fabless, foundry, OSAT (outsourced semiconductor assembly and testing), testing services, etc.

manufacturing equipment, packaging equipment, inspection and testing equipment, assembly equipment, environmental control equipment, factory automation / robot, etc.

substrate material, manufacturing material, packaging material, etc.

Silicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.

ACTT, EMPYREAN, HCHIPLET SEMICONDUCTOR, PRIMARIUS, RONG SEMICONDUCTOR, SEMITRONIX, SICHIP, SIEMENS EDA, SPLENDOR, SYNOPSYS, UNIVISTA, XPEEDIC...

CR MICRO, GLOBALFOUNDRIES, HUAHONG, NEXCHIP, SAMSUNG FOUNDRY, SMIC, HLMC, TOWER SEMICONDUCTOR, PENGXINWEI...

BLUE ROCKET ELECTRONICS, CAPCON, CHIPMORE, CHIPPACKING, FHEC, GUANGDONG 3D-SEMI, HISEMI, HT-TECH, JCET, KAIFA, LEADYO, NCAP CHINA, SHENGYUAN SEMICONDUCTOR, SINOIC, SJ SEMI, TIANCHENG, TONGFU MICROELECTRONICS, UNIONSEMICON, V-TEST, WISE ROAD CAPITAL, WLCSP, YUNTIAN...