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International Integrated Circuit Innovation Expo (IICIE 2026)
  • 60,000

    Exhibition Area(sqm)

  • 1,100+

    Exhibitors

  • 60,000+

    Professional Visitors

  • 20+

    Conferences

*Projected data at IICIE 2025

Featured Pavilions

IC Products, Packaging and Testing

IC Chips, Design/Electronic Design, Automation Services (EDA&IP), Outsourced Semiconductor Assembly and Testing Services (OSAT), Packaging Equipment/Test Equipment, Packaging Materials and Consumables/Core Components, Featured Zones (AI Computing Power and Application, Advanced Packaging, Advanced Computing) 

IC Fabrication

IC Fabrication & Foundry, IC Manufacturing Equipment, Metrology Equipment, Substrate & Manufacturing Materials & Consumables, Core Components & Parts, Featured Zone (Achievements from Universities & Research Institutes)

Compound Semiconductor

Power Devices and Modules, Materials and Substrates, Manufacturing Equipment, Packaging and Testing Equipment, Core Components, Featured Zone (Automotive Chips And Power Semiconductor)

Exhibitor Profile

Chip

AI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc.

IC Design / Manufacturing Service

IP/EDA (Electronic Design Automation), fabless, foundry, OSAT (Outsourced Semiconductor Assembly and Testing), testing services, etc.

Semiconductor Equipment

manufacturing equipment, packaging equipment, inspection and test equipment, assembly equipment, environmental control equipment, factory automation / robot, etc.

Semiconductor Material

substrate material, manufacturing material, packaging material, etc.

Semiconductor Core Parts

sealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc.

Compound Semiconductor and Power Device

Silicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.

Key Exhibitors

Exhibitor/Product List

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