International Integrated Circuit Innovation Exposition ( IICIE-2026 )

International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the full industry ecosystem, including chip & IC design, semiconductor manufacturing, packaging & testing equipment, semiconductor materials and core parts, etc.

IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other industries, delivering one-stop business connections, matchmaking, and industry exchanges.

Highlights:

1
IICIE is renowned as a highly influential and professional comprehensive exhibition covering the entire semiconductor industry chain
2
Co-located with CIOE enables seamless upstream-downstream convergence across the industry chain
3
Spotlighting key innovation frontiers including compound semiconductors (GaN/SiC), AI chips, and automotive semiconductors
4
The concurrent forums explores the latest developments of the industry from multiple dimensions including IC design, semiconductor manufacturing, packaging & testing and chip application
5
IICIE provides an efficient and open platform for business and technical exchanges. It facilitates valuable face-to-face engagement with key decision-makers in the industry.
6
The concurrent conferences, spanning academia, industry, and applications, empower businesses formulate precise development strategies by providing valuable insights on semiconductors .

Subscribe Us Post Show Report

Exhibit Profile

Chip

AI chip, communication chip, memory chip, CPU chip, sensor chip, analog chip, digital chip, power management and power chip, RF chip, driver chip, etc.

IC Design / Manufacturing Service

EDA / IP (electronic design automation), fabless, foundry, OSAT (outsourced semiconductor assembly and testing), testing services, etc.

Semiconductor Equipment

manufacturing equipment, packaging equipment, inspection and testing equipment, assembly equipment, environmental control equipment, factory automation / robot, etc.

Semiconductor Material

substrate material, manufacturing material, packaging material, etc.

Semiconductor Core Parts

sealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc.

Compound Semiconductor & Power Device

Silicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.

Key Exhibitors

Fairground Map

Booth Application Register Now

Register Now

IICIE at a Glance

Book a Stand

Product List

To the Top