In 2026, driven by explosive growth in AI computing demand, the global semiconductor industry is accelerating toward a trillion-dollar market. The pursuit of advanced chip technologies, domestic substitution, and deep cross-sector integration have become core industry trends. Against this backdrop, the International Integrated Circuit Innovation Expo (IICIE 2026) will be held from September 9–11, 2026 at the Shenzhen World Exhibition & Convention Center. Under the theme "Cross-Sector Convergence, Full-Chain Collaboration: Building a Distinctive IC Ecosystem," IICIE 2026 comprehensively covers the entire IC value chain from IC design, wafer fabrication, packaging and testing to core equipment, key materials, and components, establishing a world-class platform integrating technology showcasing, business matching, and academic exchange.

Ø  Engage in over 20 high-level conferences and deep-dive dialogues with industry thought leaders

During the exhibition, globally influential experts, scholars, research institutes, and leading industry chain enterprises will gather to discuss critical technological bottlenecks in semiconductor manufacturing, equipment and materials, advanced packaging, co-packaged optics (CPO), compound semiconductors, machine vision, intelligent manufacturing, and green fab operations. Concurrently, IICIE 2026 will focus on high-demand application scenarios such as AI chips, RISC‑V, smart vehicles, consumer electronics, security, and memory chips, building an efficient bridge between chip technology and end-market demand, and driving deep collaborative innovation across industry, academia, research, and application sectors.

l  2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Forum centers on chip manufacturing, featuring in-depth macro analyses such as "AI Empowerment: Chip-Cloud Synergy Driving Industry Innovation" and "Innovative Development of China's Semiconductor Industry," alongside cutting-edge insights into "IC Manufacturing Innovation Trends" and "Advanced Packaging Innovation." Discussions will address "Global Industry Chain Collaboration and China's Localization Development," as well as "International Semiconductor Equipment Trends," "China’s Equipment and Materials Innovation," and "Innovative Development of Semiconductor Equipment Components," offering a comprehensive view of the latest advancements and future directions in chip manufacturing.

l  IWAPS International Workshop on Advanced Patterning Solutions will be held concurrently. As a premier global event in lithography, IWAPS has been held annually since 2017. It continues to drive the adoption of cutting-edge technologies including computational lithography, DTCO, process, and metrology in China, accelerating the validation and iteration of domestic equipment and materials. IWAPS serves as an indispensable bridge connecting China with the global lithography innovation ecosystem. International giants such as Fujifilm (Japan), KLA (US), Siemens (Germany) , and ZEISS (Germany) have participated for multiple consecutive editions, alongside domestic leaders including Advanced Manufacturing, DJEL, and Kingsemi. The workshop also provides a platform for young scholars to present their research and access resources, nurturing a large pool of key technical talent for the industry.

l  The Global Semiconductor Analysts Conference will explore the theme "Navigating a New Semiconductor Era 2026–2030: Reshaping Industry Drivers, from Zero-Sum to Collaborative Innovation." Drawing on global semiconductor market trends from 2025 to 2030, the conference offers global strategic insights and development guidance for industry professionals, investment institutions, and corporate management.

l  The 1st Integrated Circuit Product and Application Collaborative Innovation Conference will establish a high-level sharing framework covering "chip design – end application – industry-academia-research integration." On the application side, leading terminal companies including BYD, DJI, OPPO, and Xiaomi, as well as representatives from industrial automation and AI sectors, are invited to share their product evolution strategies and core requirements for upstream chips. On the IC industry side, technical leaders from domestic chip design leaders such as Empyrean Technology, Unisoc, VeriSilicon, and Sanechips Technology will exchange insights on independent R&D achievements, domestic substitution progress, and chip adaptation practices. The conference will focus on four high-growth application areas: chip-cloud synergy, smart vehicles and embodied intelligence, smart terminals, and industrial manufacturing, directly addressing technical pain points and implementation challenges. 

>>>View IICIE 2026 Conference List

Ø  Triple-Expo Synergy: Direct Access to South China's Core Procurement Community

IICIE 2026 will be co-located with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo). The three exhibitions together span 340,000 square meters, hosting over 5,000 exhibitors, and leveraging South China's vast application market, are expected to attract more than 240,000 professional visitors from home and abroad. This powerful synergy drives deep integration and collaboration across optoelectronics, integrated circuits, electronics, and embedded systems, helping exhibitors efficiently connect with target customers across the entire industry chain.

For semiconductor manufacturing enterprises, IICIE 2026 enables precise connections with core industry players including IDMs, fabless companies, fabs, and OSATs, while also providing access to professional visitors from diverse fields such as optical/electronic chips, optical modules, optical lenses and modules, sensors, and electronic components, unlocking cross-sector procurement and collaboration opportunities. For chip and design companies, IICIE 2026 offers rapid access to downstream applications spanning consumer electronics, smart vehicles, robotics, AR/VR, energy, telecommunications, medical, security, and displays, as well as key resources including solution providers, system integrators, agents, and distribution channels, broadening customer reach, smoothing supply chains, and enhancing business conversion efficiency.

Ø  Connecting Global Resources, Building an Industry Ecosystem

Leveraging the strong synergy of the three co-located exhibitions, IICIE 2026 will feature a high-level global buyer matrix, precisely covering professional visitors from Germany, India, Indonesia, Japan, Korea, Malaysia, Singapore, the United Kingdom, the United States, and other countries and regions. Through years of deep cultivation in international association partnerships and global channel resources, and in collaboration with authoritative industry media and professional organizations worldwide, IICIE 2026 ensures effective global outreach and brand amplification, helping exhibitors connect precisely with international IC resources and quality buyers.

The expo will facilitate direct engagement with core semiconductor players including IDMs, fabless companies, fabs, and OSATs, while also building bridges to downstream application professionals in AI, consumer electronics, automotive, communications and computing, displays, optoelectronics, and energy, achieving seamless integration between the IC industry and downstream application scenarios, and efficiently empowering key downstream sectors.

Below is a selection of past participating companies (by industry category):

  *Partial list in alphabetical order.

At the golden intersection of semiconductor localization and intelligent development, IICIE leverages its core strengths—a full-industry-chain showcase, concentration of leading enterprises, resource integration across three exhibitions, and high-level conferences—to offer exhibitors a one-stop platform for brand promotion, technical exchange, customer engagement, and market expansion. IICIE 2026 booths are now in high demand. Secure your booth today and join this full-chain collaborative industry event of the year!

Registration for IICIE 2026 is now fully open. Secure your spot at this premier semiconductor event and enjoy a key benefit of the triple-expo synergy: one badge, full access to all three exhibitions — IICIE, CIOE, and elexcon. Complete your quick registration today and unlock a world of industry resources, innovation, and opportunity.