The global semiconductor industry stands at a pivotal moment, driven by explosive AI computing demand. With the market poised to surpass the US$1 trillion milestone in 2026, the urgency for technological advancement and resource integration has never been greater.

The 2026 International Integrated Circuit Innovation Expo (IICIE 2026) returns to the Shenzhen World Exhibition & Convention Center from 9–11 September 2026, under the theme "Cross-Sector Convergence, Full-Chain Collaboration: Building a Distinctive IC Ecosystem." As the premier event dedicated to the complete integrated circuit value chain, IICIE 2026 comprehensively showcases IC products and applications, wafer fabrication, packaging and testing, core equipment, key materials, and core components. It will gather over 1,100 leading semiconductor companies, spotlighting breakthrough technologies and innovations across all key segments. >>>Get your free pass now.

Ø  Leading Semiconductor Manufacturers Gather for One-Stop Access to Core Resources

In semiconductor manufacturing, IICIE 2026 has already brought together a distinguished lineup of enterprises covering wafer fabrication, packaging and testing, semiconductor equipment, advanced materials, as well as core components and intelligent manufacturing solutions for the semiconductor sector:

Wafer Fabrication and Packaging & Testing: Leading players including BYD Semiconductor, DJEL, HLMC, Nexchip, and other top-tier wafer manufacturing and packaging specialists will showcase their capabilities.

Semiconductor Equipment: Industry giants such as ACM Research, AMEC, Aspiring, Huayu Semiconductor, Hwatsing Technology, Piotech, Longyoude, NAURA, will demonstrate advanced technologies across critical processes including lithography, etching, deposition, and inspection.

Materials Innovation: KFMI, NSIG, Qingyi Photomask, and other material suppliers will highlight breakthroughs in domestic production of silicon wafers, sputtering targets, and other core materials.

Core Components & Intelligent Manufacturing: KYKY, RF-Cube, Vacree, and others will present semiconductor core components and intelligent manufacturing solutions.

Additionally, previous editions of the event have drawn the participation of numerous industry leaders, including Anji Microelectronics, Fortune Precision, HIWIN Technologies, Huahong Semiconductor, Jingyi Automation Equipment, Kingsemi, NAURA, Nata Opto-electronic, Peric Special Gases, SKY Technology, Shanghai Sinyang, Siasun Semiconductor, Skyverse, TZTEK, TankeBlue, Tongfu Microelectronics, and among over a thousand other prominent companies.

*Partial exhibitors listed in alphabetical order.

Ø  Chip Design Powerhouses Highlighted in Theme Pavilions

Empyrean Technology, Ingenic Semiconductor, Montage Technology, Sanechips Technology, Unisoc, and other chip design leaders will unveil high-performance computing, memory, communication, automotive-grade, and industrial control chip solutions, plus cutting-edge EDA tools. Past IICIE editions have also attracted industry leaders lincluding C*Core, Pango Microsystems, VeriSilicon, XMC, and Zhaoxin, creating a strong industrial cluster effect.

IICIE 2026 will feature dedicated “AI+ Application Pavilion” with three focused sectors: automotive electronics, high-performance computing, and smart wearables. It will bring together chip designers, solution providers, and terminal manufacturers to form a full-chain platform for technology display and business matching. Exhibitors will conduct live product teardowns focusing on core chips and components with real-time technical explanations, while immersive experience zones allow visitors to interact hands-on with cutting-edge products.

Ø  High-Precision Drive Solutions Power Intelligent Manufacturing Upgrades

Semiconductor processing is rapidly advancing into high-end equipment, precision manufacturing, and smart production lines. As automation evolves toward advanced semiconductor manufacturing, core components play an enabling role. IICIE 2026 provides one-stop access to servo motion control systems, industrial sensors, machine vision, and other key components, delivering the hardcore technologies that drive automation equipment evolution and help companies bridge the gap from general automation to advanced semiconductor manufacturing.

20+ High-Level Concurrent Forums Featuring Industry Thought Leaders

IICIE 2026 will bring together globally influential experts, scholars, and industry leaders to address critical fields including semiconductor manufacturing, equipment and materials, advanced packaging, CPO (Co-packaged Optics), compound semiconductors, machine vision, intelligent manufacturing, and green fab operations. By focusing on application scenarios such as AI chips, RISC‑V, smart vehicles, consumer electronics, security, and storage chips, IICIE 2026 will build an efficient bridge between chip technology and end-market demand, driving deep collaboration among industry, academia, research, and application sectors. IICIE 2026 key forums include:

l  IICIE 2026 Opening Ceremony & Integrated Circuit Innovation Forum centers on chip manufacturing, covering macro topics such as “AI Empowerment and Chip-Cloud Synergy” as well as advanced packaging, equipment, and materials, offering a comprehensive view of the latest advancements in chip manufacturing.

l  IWAPS International Workshop on Advanced Patterning Solutions, a world-class lithography event now in its 9th edition, will gather global giants and domestic leaders including Advanced Manufacturing DJEL, EDA, KLA, and ZEISS, serving as a vital link between China and the global lithography innovation ecosystem.  

l  The Global Semiconductor Analysts Conference will focus on “Navigating a New Semiconductor Era 2026–2030”, providing strategic insights for industry and investment communities.

l  The 1st Integrated Circuit Product and Application Collaborative Innovation Conference will create a high-level dialogue platform between chip design and end applications. Leading terminal companies including BYD, OPPO, and Xiaomi will join chip giants such as Unisoc and VeriSilicon to address technical challenges and commercialization in smart vehicles, embodied AI, and industrial manufacturing.

Ø  Three Co-located Expos, One Ecosystem: Optoelectronic Integration Breaking Down Industry Silos

IICIE 2026 co-locates with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo), creating an unprecedented industry convergence spanning integrated circuits + optoelectronics + electronics and embedded systems. This tri-expo synergy integrates comprehensive industry resources — one badge grants full access to all three exhibitions, enabling visitors to connect with premium suppliers, discover frontier technologies, expand high-level industry networks, and seize core opportunities across the semiconductor ecosystem. This is a must-attend platform for professionals in semiconductors and related fields.

Spanning 340,000 square meters, the three co-located events will host over 5,000 exhibitors, and are expected to attract more than 240,000 professional visitors from home and abroad, powerfully driving the deep integration of the integrated circuit, optoelectronics, and embedded electronics industries. In the span of a single exhibition, attendees can experience the complete industry chain from semiconductor manufacturing and chip design to optical chips, optical modules, sensors, embedded systems, and downstream applications spanning consumer electronics, smart vehicles, robotics, energy, displays, security, and beyond.

Registration for IICIE 2026 is now fully open. Complete your quick registration to secure your place at this premier semiconductor industry event and gain early access to global industry resources. Register by April 15 to receive the complete set of IICIE 2025 show catalogue! This is the ultimate destination for semiconductor professionals to find suppliers, explore cutting-edge technologies, expand industry networks, and seize market opportunities.

Meanwhile, IICIE 2026 booths are still in high demand. Leveraging its core strengths—a full-industry-chain showcase, concentration of leading companies, resource integration across three exhibitions, and high-level conferences—IICIE 2026 offers exhibitors a one-stop platform for brand promotion, technical exchange, client engagement, and market expansion. Quality players in the semiconductor industry are cordially invited to join. Book your booth now to tap into South China's vast application market and connect with global IC resources and premium buyers.