Driven by the explosive demand for AI computing, accelerating automotive electrification, and the booming display and energy industries, global semiconductor manufacturing is entering a critical cycle of capacity expansion, technological iteration, and supply chain restructuring. Industry demand continues to rise, the pace of domestic substitution is accelerating, and collaborative development across the industrial chain has become the key to breaking through bottlenecks.

To bridge the barriers across IC design, wafer fabrication, packaging and testing, semiconductor equipment, key materials, and core parts – and to help enterprises efficiently connect with global resources, expand downstream markets, and enhance brand competitiveness – the International Integrated Circuit Innovation Expo (IICIE 2026) will be held from September 9 to 11, 2026 at the Shenzhen World Exhibition & Convention Center.

IICIE 2026 aims to create a high-end, comprehensive platform for the semiconductor manufacturing industry, integrating product displays, technical exchanges, business negotiations, and innovation discussions to empower high-quality industry development.

High-Caliber Exhibitor Lineup: Industry Leaders Across the Full Chain

IICIE 2026 has already attracted well-known enterprises from across the semiconductor industry chain, forming a complete exhibition matrix covering design, manufacturing, packaging, equipment, materials, and parts – facilitating efficient upstream-downstream collaboration and resource complementarity.

• Wafer Fabrication & OSAT: Biwin Storage, BYD Semiconductor, EJEL, HLMC, MXTRONICS, NCAP CHINA, Nexchip, others, SKY CHIP INTERCONNECTION, Sky Semiconductor, Tongfu Microelectronics, and others – showcasing technology and services in wafer manufacturing and advanced packaging.

• Semiconductor Equipment: ACM Research, Aspiring, CETC, CMSEMICON, Huayu Semiconductor, Hwatsing, Jingce Electronic, Longyoude, NAURA, Ncatest Technologies, Piotech, Shenyang Heyan Tech, U-Precision – covering lithography, etching, metrology/inspection, and other critical processes.

• Key Materials: Anji Microelectronics, Konfoong Materials, National Silicon Industry Group (NSIG), Peric Specialty Gases, Shanghai IC Materials Research Institute, Shanghai Sinyang, Upermask – showcasing silicon wafers, targets, specialty gases, and other materials supporting supply chain autonomy.

• Core Parts & Intelligent Manufacturing Services: HIWIN, KingLai Group, SIASUN, Vacree, Zhongke Instruments – presenting semiconductor core components and intelligent manufacturing solutions.

• IC Design: Empyrean, Ingenic, Montage Technology, Semitronix, Zhaoxin Semiconductor, ZTE Microelectronics – featuring innovations in AI computing power, automotive-grade chips, and more.

Focus on Industry Trends: Cutting-Edge Technologies on Display

Aligned with key industry trends such as the AI computing power revolution, Chiplet heterogeneous integration, accelerated domestic substitution, and advanced process breakthroughs, IICIE 2026 focuses on the core links of the semiconductor manufacturing chain and presents six major sectors covering full-scenario industry needs:

• Wafer Fabrication: Focuses on 8/12-inch wafer foundry services, specialty processes, advanced logic processes, SOI substrates, AI-dedicated wafers, chiplet-compatible processes – addressing cloud AI and data center chip capacity needs.

• Packaging & Testing: Focuses on core incremental growth in AI server packaging, highlighting advanced packaging, system-level packaging, chiplet heterogeneous integration, and other frontier technologies, covering critical processes including TCB thermal compression bonding and copper-copper hybrid bonding, adapted to high-computing-power chip packaging demands.

• Core Equipment: Covers front-end/back-end complete equipment sets including lithography, etching, and thin-film deposition, showcasing HBM packaging-specific equipment, AI wafer automated process equipment, and more, helping enhance semiconductor manufacturing automation and intelligence levels.

• Key Materials: Covers silicon wafers, specialty gases, photoresists, ABF substrates for HBM, automotive-grade high-purity materials, meeting high-end material demands in AI and automotive electrification.

• Core Parts: Focuses on core areas including high-end RF power supply localization, showcasing the latest achievements in domestic substitution, supporting autonomous and controllable upgrades across the complete value chain.

• Compound Semiconductor: Showcases SiC and GaN compound semiconductor materials and power devices, simultaneously displaying automotive-grade SiC substrates, energy fast-charging power solutions, and more, helping drive industrial upgrades in new energy, automotive electronics, and other fields.

Over 20 Forums: Tackling Critical Industry Bottlenecks

More than 20 forums will be held concurrently, focusing on semiconductor manufacturing, advanced packaging and testing, compound semiconductor, intelligent manufacturing, IC design, and other key areas.

• Integrated Circuit Innovation Forum – Bringing together top industry leaders to discuss policy directions, technology trends, pain points, and global collaboration.

• IWAPS International Workshop on Advanced Patterning Solutions – Held during IICIE 2026, with 53% sponsorship from international leading companies and 47% from domestic enterprises. Covering the full lithography ecosystem from lithography tools and metrology to photoresists. International giants such as KLA (USA), Siemens (Germany), and Fujifilm (Japan) – as well as domestic leaders including Advanced Manufacturing EDA and DJEL – will participate.

• Advanced Packaging &Testing Technology Forum – Focusing on HPC packaging breakthroughs, analyzing technology evolution from CoWoS to CoPoS, equipment pain points, and supply chain layout – providing a clear roadmap for AI packaging mass production.

• Global Semiconductor Analyst Conference – Four sessions focusing on supply chain restructuring, regional opportunities, AI, new wafer fabs, advanced packaging, M&A, quantum computing, and other future technologies – empowering corporate decision-making.

 Three Concurrent Exhibitions: Significantly Enhanced Participation Value

This year, IICIE 2026 will be co-located with the China International Optoelectronic Exposition (CIOE 2026) and Shenzhen Electronics & Embedded Expo (elexcon 2026). The aggregate exhibition space spans 340,000 square meters, gathering over 5,000 exhibitors and projected to attract more than 240,000 professional visitors. This three-show collaboration builds an efficient one-stop platform to connect upstream and downstream industrial resources, fully integrating the complete semiconductor ecosystem covering chips, components, modules, solutions and applications. Exhibitors can connect with IDMs, fabless, fabs, OSATs, and other industry professionals, while engaging in deep exchanges with fellow exhibitors – significantly elevating overall participation value.

International Buyers Gather: Direct Access to High-Quality Business Opportunities

Leveraging the massive resources of the three co-located exhibitions, IICIE 2026 will attract numerous renowned companies, including: AGC, ASM International, ASMPT, GlobalFoundries, Marvell, Tower Semiconductor, Applied Materials, Tokyo Electron, KLA, Lam Research, Intel, Source Photonics, NVIDIA, Samsung Semiconductor, Texas Instruments, Qualcomm, and many more.

Exhibitors can leverage this platform to efficiently explore international markets, connect with global industry partners, and capture high-quality business opportunities to drive scalable business growth.

Currently, over 80% of exhibition booths have been reserved, with reservation momentum continuing to accelerate. Secure your booth or make inquiries promptly to gain first-mover advantage in connecting with premium semiconductor value chain resources. Visitor pre-registration is now open. Click here to register with one click for one badge granting access to all three expos.

We cordially invite industry professionals to gather in Shenzhen this September for this premier semiconductor industry event, jointly building a new industrial ecosystem.

About International Integrated Circuit Innovation Expo (IICIE)

International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the entire ecosystem across IC design, manufacturing & packaging equipment, core parts and materials.

IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other fields, delivering one-stop business connections, matchmaking, and industry exchanges.