The International Integrated Circuit Innovation Expo (IICIE 2026) will be held from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center. This year, IICIE 2026 will be co-located with China International Optoelectronic Exposition (CIOE 2026) and Shenzhen Electronics & Embedded Expo (elexcon 2026). With a total exhibition space of 340,000 square meters, the three-exhibition collaboration will gather over 5,000 exhibitors and is projected to attract more than 240,000 professional visitors. This integrated event creates an efficient one-stop platform for connecting upstream and downstream industrial resources, fully integrating the entire ecosystem spanning chips, components, modules, solutions, and applications. Covering three key sectors—semiconductor, optoelectronics & photonics, electronics & embedded systems—it enables resource sharing, mutual enhancement, and seamless industry collaboration.

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Ø  Chip Zone: Comprehensive Chip Offerings – AI, Automotive, and Storage at the Forefront

As the core of the industry, IICIE 2026 will showcase a complete range of chip products including AI chips, communication chips, memory chips, CPUs, sensors, analog/digital chips, power management, RF, driver chips, and more. Leveraging the advantages of South China's electronics and information industry hub, IICIE 2026 has attracted leading companies such as Empyrean, Ingenic, Montage Technology, Semitronix, Zhaoxin Semiconductor, ZTE Microelectronics to showcase breakthroughs in high‑performance, high‑reliability, automotive‑grade, and industrial‑grade chips.

In addition, many high-quality enterprises will exhibit at IICIE 2026, including ams OSRAM, China Science Photon Chip, CIG, Coherent, DXY, Everbright Photonics, GigaDevice, Guangzi, Hisense, Hisilicon, Liobate, LUXIC, MeenYi, MiniSilicon, Mitsubishi Electric, Opto Sensor, PHOGRAIN, PhotonIC, QXP Technologies, Quantum Infrared, Raysees, RaySea, Sanan Semiconductor, Shanghai Belling, Shijia Photons, Sitrus Technology, Source Photonics, TOP-IC, UX IC, Vertilite, Yunling– collectively shaping a new landscape for chip development.

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Ø  Dedicated Application Zones: Focusing on High-Value Applications

AI + Application Featured Zone – Three Core Areas Defining New Intelligent Scenarios

Focusing on automotive electronics, high‑performance computing power, and smart wearables, this zone brings together three types of exhibitors: chips, solutions, and products, forming a full‑chain display and matching platform. Onsite product teardowns, technical briefings, and immersive experience areas will be featured. Leading enterprises including Alibaba Cloud, ARM China, Baidu Cloud, Black Sesame, Horizon Robotics, Intellifusion, Rockchip, SpacemiT, Tencent Cloud, and others are invited to appear together, jointly driving deep integration of AI computing power with automotive, wearable, and high-performance computing scenarios.

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RISC-V Ecosystem + Application Display Zone – Open Architecture for Autonomous Control, Reshaping the Future of Computing

Highlighting on open architecture, software‑hardware collaboration, and full‑scenario deployment, this zone showcases core IP, high‑performance processors, and native operating systems, covering complete application ecosystems for AI, automotive, industrial, IoT, and data centers.

It witnesses RISC‑V's breakthrough in breaking architectural monopolies and its march toward autonomous control – presenting in one place how open‑source chips enable end‑cloud integrated computing power, automotive‑grade chips, edge AI terminals, and smart hardware, providing an innovative path for computing architectures.

Advanced Packaging & Testing: SiP / CPO at the Forefront – Breaking Through Computing Power Bottlenecks

Responding to the explosion of AI computing power and the demand for high‑speed interconnection, IICIE 2026 brings together leading companies including BYD SEMICONDUCTOR, DJEL, HLMC, MXTRONICS, NCAP CHINA, NEXCHIP, SKY CHIP INTERCONNECTION, SKY SEMI, TONGFU MICROELECTRONICS – showcasing technologies and services in wafer fabrication and packaging & testing.

The expo focuses on hotspots such as advanced packaging & testing, equipment, materials, compound semiconductors, CPO (co‑packaged optics), and SiP (system‑in‑package).

Ø  High‑Level Forum Matrix: Chip‑Focused Forums Exploring Application Scenarios

More than 20 high-level conferences and forums will be held concurrently, focusing on chips and related applications. Covering core topics including automotive chips, consumer electronics, RISC-V, EDA & IP, AI, memory, security, and industrial control, these forums will promote upstream-downstream collaborative development.

* Agenda is subject to change

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In addition, a series of "Optoelectronics + Application Forums" will be held concurrently, covering smart homes, AR & VR, micro‑displays, automotive, and intelligent robotics. These forums will create deep convergence between chips and optics‑enabled application scenarios.

Ø  High‑Caliber Buyers: Covering Diverse Application Fields

IICIE 2026 will strategically invite high-quality visitors across the entire industry chain, building an efficient matching bridge for exhibitors. Amid the global semiconductor industry’s march toward a trillion-dollar market, this targeted buyer invitation ensures exhibitors connect with key decision-makers and drive business growth.

Partial list of participating companies in alphabetical order:

• Distributors / Agents / Solution Providers: Bestshare, CECport, i-sange, ICKEY, Jinrong, Lian Sheng Electronics, MetaX, OnMicro, Richwell Electronics, Senary Technology, Sinox, UIC, WPI, Xujin

• Robotics: Aiper, Anker Innovations, Dataa Robotics, Dreame, Ecovacs, iRobot, Narwal, OrionStar, Roborock, UBTECH

• Consumer Electronics: DJI, Great Wall, Guangli, Hisense, Huawei Device, iFlytek, Imoo, Lenovo, OPPO, TCL Communication, Transsion, VIVO, Xiaomi, ZTE

• Automotive: BYD Auto, Chang'an Auto, Desay SV, GAC Group, Geely Auto, Hawtai Motor, Hyundai Mobis, Li Auto, NIO, SAIC GM, Valeo, Xiaomi Auto, Zeekr

• Computing & Communications: Alibaba Cloud, Aofei Data, Baidu, ByteDance, China Mobile, China Telecom, China Unicom, Huawei, IEIT SYSTEMS, JD.com, Meituan, Tencent, Topbrand Motor, ZTE

We sincerely invite industry professionals to gather in Shenzhen this September for this premier integrated circuit industry event – working together to build a new industrial ecosystem.

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About International Integrated Circuit Innovation Expo (IICIE)
The International Integrated Circuit Innovation Expo (IICIE) is a high‑end, comprehensive platform for the semiconductor industry, covering IC design, wafer fabrication, packaging and testing, equipment, materials, and core parts. It serves as a vital hub for product display, technical exchange, business matching, and innovation discussion – empowering high‑quality industry development through full‑chain collaboration.