As large AI models and 100,000-card computing clusters rapidly accelerate, industry development has transcended the independent evolution of optics, storage, electricity, and chips. Optical interconnects form the core framework for efficient computing cluster communication. Integrated circuit manufacturing and advanced packaging lay the process foundation for silicon photonics and Co-Packaged Optics (CPO). High-end memory chips determine the data throughput of computing clusters, while electronic systems and embedded technologies enable the ultimate deployment of computing power.

Against this backdrop, the International Integrated Circuit Innovation Expo (IICIE 2026), the 27th China International Optoelectronic Expo (CIOE 2026), and Shenzhen International Electronics & Embedded Expo (elexcon 2026) will be held concurrently from September 9–11 at the Shenzhen World Exhibition & Convention Center, China. These three co-located events offer complementary focus areas and deeply interconnected supply chains, establishing a seamless link from upstream materials to downstream applications. Visitors can efficiently explore the entire AI computing power industry chain in one place, significantly reducing cross-sector coordination costs while accelerating technology partnerships and commercial relationships. Together, the three exhibitions form a premier global platform for technology exchange, business matchmaking, and ecosystem development.

IICIE 2026: Building the Foundation for Silicon Photonics & CPO Commercialization

As a comprehensive platform spanning the semiconductor value chain, IICIE provides essential support for foundational manufacturing processes. The expo emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and hybrid bonding heterogeneous integration—all essential for commercializing silicon photonics, CPO, and HBM memory.

Key Focus Areas:

• Materials & Equipment for Volume Production: Exhibitors will showcase SOI wafers, photoresists, specialized packaging substrates for silicon photonics, alongside critical equipment including lithography, etching, thin-film deposition, and optical coupling testing, comprehensively strengthening silicon photonics manufacturing capabilities.

• Advanced Packaging for Photonics Integration: Heterogeneous integration technologies like CoWoS, SoIC, hybrid bonding, and TSV stacking enable high-density co-packaging of photonic and electronic chips, directly driving CPO toward mature mass production.

• End-to-End Supply Chain Collaboration: Wafer fabrication and OSAT providers can connect onsite with CIOE's silicon photonics and optical module vendors, while providing stacking and packaging services to elexcon memory chip exhibitors. This builds an integrated supply network spanning IC processes → optoelectronic devices → memory chips, addressing critical industry challenges in process compatibility and manufacturing yield.

Featured IICIE 2026 Exhibitors:

• Wafer Fab & OSAT: Biwin Storage, BYD Semiconductor, DJEL, HLMC, MXTRONICS, Ncap China, Nexchip, SKY CHIP INTERCONNECTION, Sky Semiconductor, Tongfu Microelectronics, among others

• Semiconductor Equipment: ACM RESEARCH, ASPIRING, CETC, CMSEMICON, HUAYU SEMICONDUCTOR, HWATSING, JINGCE ELECTRONIC, LONGYOUDE, MAXWELL, MITUTOYO, NAURA, NCATEST TECHNOLOGIES, PIOTECH, SHENYANG HEYAN TECH, SKYVERSE, U-PRECISION, specializing in lithography, etching, and inspection technologies

• Materials: ANJI MICROELECTRONICS, KONFOONG MATERIALS, NATIONAL SILICON INDUSTRY GROUP (NSIG), PERIC SPECIALTY GASES, SHANGHAI IC MATERIALS RESEARCH INSTITUTE, SHANGHAI SINYANG, XILONG SCIENTIFIC, UPERMASK, supplying wafers, targets, specialty gases, and other critical materials

• Core Parts: HIWIN, KINGLAI GROUP, SIASUN, VACREE, ZHONGKE INSTRUMENTS, highlighting core parts and advanced manufacturing solutions

The three co-located exhibitions bring together leading exhibitors across semiconductor manufacturing, assembly, and testing: ADT, ASMPT, ASTRO PLASMA, ATTACH POINT, BOZHON SEMICONDUCTOR, E-Globaledge, ENERGY INTELLIGENT, EXFO, Finetech, GlobalFoundries, GLRH, HEYAN INTELLIGENT, ISMC, JEOL, JING CHUANG ADVANCED ELECTRONIC, LASER X, LIEQI INTELLIGENT, MICROVIEW INTELLIGENT, MKS, MPI, MRSI (Mycronic Group), OXFORD INSTRUMENTS, PIC, PRECISION, Raith, Samco, SENTECH, TECDIA, Tower Semiconductor, YOSHINAGA SHOJI, ZHICUBIC, and more.

CIOE 2026: The Optical Interconnect Hub for AI Computing Clusters

As a flagship event in the global optoelectronics industry, CIOE highlights optical chips, high-speed optical modules, silicon photonic integration, and CPO optical engines, directly tackling the bandwidth and power consumption challenges facing AI computing clusters.

With 800G optical modules now in mass production and 1.6T products advancing rapidly, high-speed optical modules serve as the information highway connecting computing servers. Optical chips and silicon photonics represent the core components determining data interconnect speed and efficiency. CIOE 2026 features CW lasers, EML, VCSEL, silicon photonic PICs, linear drive chips, 1.6T/3.2T optical modules, CPO/LPO/XPO solutions, and related packaging equipment, demonstrating the essential role of optical interconnects in 10,000-card and 100,000-card AI clusters.

CIOE 2026 bridges IICIE’s semiconductor manufacturing and advanced packaging capabilities with elexcon’s computing systems and storage companies, creating a full chain from silicon photonic chip manufacturing → CPO integration → high-speed optical interconnect deployment. This provides computing power enterprises with low-latency, energy-efficient optical interconnect solutions.

Featured CIOE 2026 Exhibitors:
Leading global optoelectronics companies including Accelink, Advanced Fiber Resources, Broadcom, CIG, Coherent, CompoundTek, Credo, ENABLENCE, Eoptolink, Everbright Photonics, H3C, HG Tech, HiSilicon, KAM, LIGENTEC SA, Ligent, Linktel, LUCEDA PHOTONICS, Lushare, MACOM, MARVELL, MITSUBISHI ELECTRIC, O-Net Technologies, PHOGRAIN, PIC, Pioseed, PLANSEE, POET, SEMTECH, SICOYA, SIFOTONICS, Siluxtek, SIMWORKS, Taclink, WD PHOTONICS, WOORIRO, and many more will showcase their latest innovations.

IICIE + elexcon: Advancing Compute-in-Memory for Peak Performance

IICIE brings together chip design leaders including EMPYREAN TECHNOLOGY, INGENIC, MONTAGE TECHNOLOGY, SANECHIPS, SEMITRONIX, and VIA ALLIANCE SEMICONDUCTOR, featuring dedicated pavilions for AI + High-Performance Computing and RISC-V Ecosystem to strengthen the China’s AI computing value chain.

elexcon focuses on electronics and embedded systems, showcasing AI memory chips/modules, embedded AI, power solutions, high-speed connectors, and more. Major participants include ADVANTECH, ARM, KOWIN, SEGGER, TECHWINSEMI, and YMTC.

At the core of this three-exhibition convergence, IICIE and elexcon together create a processing-in-memory ecosystem that optimizes computing system performance, while CIOE delivers high-speed optical interconnects. This powerful integration seamlessly combines internal compute-memory interaction with external optical data transmission, enabling a comprehensive approach to AI infrastructure.

Through the co-location of IICIE, elexcon, and CIOE, attendees gain visibility into the complete AI implementation value chain. Upstream coverage includes memory and computing chip design, packaging and testing. Midstream encompasses the full computing hardware and supporting solutions. Downstream connects directly to high-speed optical interconnect modules. The entire journey unfolds—from chip packaging and modules, through optical interconnect systems, to edge computing and AI applications. This integrated showcase vividly demonstrates the coordinated evolution of integrated circuits, storage, and optical interconnects, enabling large-scale edge-side AI deployment across industries.

Concurrent Forums: In-Depth Insights Across the Entire Technology Spectrum

The three co-located exhibitions will host professional forums covering the entire technology chain from foundational processes and packaging technologies to system-level applications. These sessions will deliver comprehensive insights into emerging industry trends and technology directions:

1. Photonics-Electronics Convergence Technology and Industrial Development Forum: Bringing together research institutes, the China Academy of Information and Communications Technology (CAICT), telecom operators, industry analysts, and leading experts in devices, manufacturing, packaging, testing services, and equipment, this forum will explore cutting-edge advancements in silicon photonic integration, co-packaging, optical computing chips, and core optical components. The objective is to drive optoelectronic integration from isolated breakthroughs to full-chain maturity, driving the digital economy forward.

2. Advanced Packaging & Testing Technology Forum: This forum will gather key players across the entire packaging and testing value chain—equipment, materials, and OSAT. It will focus on 3.5D heterogeneous integration architectures, with in-depth discussions on innovative design approaches combining hybrid bonding and 2.5D  interposers, alongside thermal management solutions for high-performance chips. The forum will also address emerging applications such as silicon  photonic CPO and glass core substrates, systematically analyzing how optical interconnect technologies and low-loss materials significantly reduce data center latency and optimize power efficiency.

3. 2026 Forum on CPO & Optoelectronic Heterogeneous Integration in the AI Computing Power Era: Centered on CPO industrialization with evolving AI computing infrastructure, this forum will bring together companies across design, manufacturing, packaging, materials, equipment, EDA, and end-user applications to explore new technology roadmaps and industry ecosystems for the optoelectronic convergence era.

4. SiP China 2026 Conference: Featuring a dedicated sub-forum on Optoelectronic Interconnects, this session will delve deeply into CPO (Co-Packaged Optics) technology, marking a formal shift in packaging from the electrical-only era to the optoelectronic-hybrid era, and addressing critical power and bandwidth bottlenecks in AI data centers.

5. Source of Intelligent Computing: 2026 Chip Computing Power Innovation Summit: Positioned as a high-level dialogue platform focused on the chip design value chain, this summit will bring together world-leading design houses, EDA providers, and key IP providers. Discussions will center on how to overcome computing power limitations and reshape the industry ecosystem in the post-Moore era through architectural innovation, design flow transformation, and IP reuse strategies.

Core Value Proposition: Integrated Access to the Complete AI Optoelectronics-Chip-Storage Ecosystem

Co-locating these three major events creates powerful synergies through resource sharing and complementary strengths, delivering substantial value across the industry:

Unprecedented Scale: 340,000 sqm of exhibition space, 5,000+ exhibitors, and over 240,000 anticipated professional visitors. Covering the three core sectors of optoelectronics, integrated circuits, and electronic embedded systems, the events generate significant industry clustering effects.

Streamlined Sourcing: Experience the entire value chain from semiconductor materials and equipment to silicon photonics, CPO, HBM, and embedded systems in a single visit.

Cross-Sector Networking: Optical chip vendors can connect with foundries and OSATs; packaging and testing companies can access both silicon photonics and HBM markets; system vendors can source optical modules and integrated optoelectronic components in one place, enabling efficient cross-sector collaboration and fast-tracked business development.

As the computing power era unfolds, supply chain collaboration has never been more critical. This year’s co-location of CIOE, IICIE, and elexcon breaks down the limitations of single-industry events, integrating resources through a comprehensive value chain perspective. It builds a superior platform for technological innovation, supply-demand matching, and ecosystem partnership, supporting the high-quality development of AI computing infrastructure in China.

Register now to secure your all-access badge for three exhibitions! We invite industry professionals worldwide to join us in Shenzhen this September for this premier industry event. Together, let's shape the future of the optoelectronics-chip-storage industry.