IICIE 2026 (International Integrated Circuit Innovation Expo) will take place September 9-11, 2026, at the Shenzhen World Exhibition & Convention Center. This year's edition offers a comprehensive view of the semiconductor industry value chain, spanning chip and IC design, power semiconductors, wafer fabrication, packaging and testing services, semiconductor equipment, materials, and core parts.

Co-Located Mega Events: Semiconductor x Photonics x Electronics

IICIE 2026 runs alongside CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo), forming a massive 320,000 sqm technology showcase. Together, the three events bring together over 5,000 exhibitors and are expected to draw more than 240,000 professional visitors, covering semiconductors, optoelectronics, and electronics & embedded systems under one roof. A single badge unlocks access to all three shows, making cross-sector networking and business matching more efficient than ever. > Get your free pass now

Full-Spectrum Semiconductor Manufacturing Value Chain

IICIE 2026 serves as a comprehensive platform covering the entire semiconductor production cycle – from wafer fabrication through packaging and testing, to equipment, materials, and core components. The expo emphasizes foundational process technologies and next-generation advancements, with a spotlight on:

• 2.5D/3D advanced packaging

• Hybrid bonding and heterogeneous integration

• Silicon photonics

• Co-Packaged Optics (CPO)

• High Bandwidth Memory (HBM)

These innovations are key enablers for large-scale commercial deployment across the industry.

In the wafer fabrication and OSAT (packaging & testing) segments, leading players including GTA Semiconductor, HT-Tech, Huahong Group, Nexchip, Tongfu Microelectronics, and XMC will showcase advanced solutions such as 12-inch wafers (28nm high-performance compact process), silicon photonic wafers, 3D integrated wafers, advanced logic processes, and mixed-signal process technologies.

Key Exhibitor Lineup by Sector

u  Wafer Fabrication, Packaging & Testing Services:

Advinno, ANJI HAIWANXIN, BIWIN Storage, Centraway, GTA Semiconductor, HT-Tech, Huahong Group, Kore Semiconductor, MXTronics, Nexchip, SOI Micro, Tongfu Microelectronics, XMC, ZENSEMI, and more.

u  Semiconductor Equipment:

ACM RESEARCH, Aspiring, CETC (Beijing), DJEL, Huayu Semiconductor, Hwatsing, Jingce Electronics, Longyoude, Maxwell, Mitutoyo, PIOTECH, R.D.S, SKYVERSE, U-PRECISION, VEGA TECHNOLOGY, Winmax, WIZSHINE Semiconductor, and more.

u  Semiconductor Materials:

1S Technology, Anji Microelectronics, Chengdu Carbon, Monte-Bianco, Mrisen, NSIG, Peric, Shanghai Sinyang, SUPERMARSK, Tankeblue, XILONG SCIENTIFIC, Zhongbao New Materials, and more.

u  Semiconductor Core Parts:

Canrill, GY-TECHNOLOGY, Hiwin, Keyence, Kinglai, OMAT Advanced Materials, RF-CURE, SIASUN Microelectronics, Speck, STARCHAIN, Vacree, XINGQI, Zhongke Yi, and more.

u  IWAPS Lithography Zone:

The IWAPS Lithography Zone brings together companies specializing in lithography metrology and inspection, precision optics, thermal process management, photoresist materials, and equipment cleaning/maintenance. This zone covers the complete ecosystem supporting advanced lithography processes from exposure and pattern inspection to material supply and equipment support, showcasing integrated solutions that enhance lithography yield and drive technological advancement. Featured exhibitors include ADVANTEST, ESSE, JHEAT, JUMING CHEMICAL, RUIYUE TRADING, THERMOS FISHER, and more.

Across the co-located mega event, visitors will also have direct access to a broad lineup of wafer foundries, OSATs, and equipment manufacturers, including:

All-SEMI, ASMPT, ASTRO PLASMA, Colibri, CUMEC, E-Globaledge, Finetech, GlobalFoundries, Huachuang Intelligent, in-cube, JEOL, Mingseal Robot, MKS, MPI, MRSI (Mycronic Group), Navikey, Oxford Instruments, PI (Physik Instrumente), PIC, QUICK Semiconductor, Raith, Samco, Semc Microelectronics, THERLICON, Tower Semiconductor, UNT, and more.

Spotlight on Hot Tracks: Chinese Chip Innovation Takes Center Stage

Leveraging Shenzhen's position as the electronics and information hub of South China, IICIE 2026 places special emphasis on three high-growth sectors: high-performance computing, automotive electronics, and consumer electronics. The expo showcases innovative chip products and core parts solutions from industry leaders including BYD Semiconductor, CR Micro, Fudan Microelectronics, Guoxin MICRO, IA Semiconductor, Ingenic, Montage Technology, SANECHIPS, Semitronix, VIA Alliance Semiconductor.

In high-performance computing, companies such as Fudan Microelectronics, Montage Technology, NeuSemi, XuanTie, and Yunlink Semiconductor will present cutting-edge offerings including ultra-high-performance cloud security chips, memory expansion controllers, RISC-V CPUs, programmable SoCs, and Ascend edge AI computing systems – demonstrating the growing strength of China's compute capabilities.

In automotive sector, AXD, BYD Semiconductor, and SANECHIPS will showcase automotive-grade products such as 5G+V2X chips, 4nm autonomous driving processors, embedded storage chips, and automotive AI MCUs, supporting the localization and premiumization of automotive semiconductors.

In consumer electronics sector, companies like AistarTek, Taixin Semiconductor, and Weijie Semiconductor will introduce innovations including ultra-low-power edge multimodal inference chips, high-precision accelerometers, and audio/video Wi-Fi SoCs, addressing diverse applications from smart wearables to consumer terminals.

IICIE 2026 also features multiple featured product zones focused on chip design, open-source ecosystems, and computing applications.

In partnership with Xin Master, a leading Chinese semiconductor media outlet, Chip Application Zone covers automotive electronics, high-performance computing, smart wearables, and more. Exhibitors will showcase end-to-end solutions—from chip design and system architectures to industrial deployment—through live product demonstrations and teardowns. Onsite technical specialists will deliver real-time briefings focused on core chips and components. An immersive demonstration area will be set up to facilitate in-depth engagement among device manufacturers, chip designers, and component suppliers, helping address coordination challenges across upstream and downstream hardware links. Featured exhibitors cover BRITE SEMICONDUCTOR, BINARY SEMICONDUCTOR, HERCULES MICROELECTRONICS, GEEHY, SYSUMMIT.

In collaboration with ICRANK and IC TIME, RISC-V Ecosystem Zone brings together leading enterprises in the RISC-V field. It offers a focused showcase of processor IP, high-performance computing chips, software and hardware platforms, and industrial deployment solutions—demonstrating the end-to-end RISC-V ecosystem from foundational architecture to real-world implementation. Featured Exhibitors: C*CORE, CHIPV, SPACEMIT, SOPHGO, WINGSEMI TECHNOLOGY, XUANTIE.

An exclusive Chip Zone covers core tracks including computing GPUs, robot main control, optical interconnect, compute-in-memory (CIM) AI, wireless IoT SoCs, audio/video and analog chips, industrial embedded storage, and semiconductor intelligent manufacturing software. It offers a comprehensive showcase of chip innovations and one-stop solutions. Featured exhibitors include AISTARTEK, AMICRO, AXD, FUTUREFAB, TAIXIN SEMICONDUCTOR, XIANGDIXIAN, YUNLINK-SEMI, presenting a diverse range of domestic chip innovations and integrated industry solutions.

Additional Exhibitors Across Three Co-Located Exhibitions:

Visitors will also see optical communication chips, sensor chips, memory chips and modules, power semiconductors, and power supply solutions from companies including China Science Photon Chip, CIG, Coherent, ETERN-LASER, ELITE, LIOBATE, Mitsubishi Electric, PHOGRAIN, QXP, Shanghai Belling, Shijia, Sicoya, Sifotonics, SILUX, WD Photonics, Xizhi, XPHOR, etc.

University & Research Institute Showcase: Advancing Semiconductor Frontiers

To accelerate technology commercialization and foster industry innovation, IICIE 2026 features a dedicated University & Research Institute Zone (Hall 16) highlighting cutting-edge R&D from China's leading academic institutions. This zone serves as a bridge between research and industry, enabling attendees to track next-generation semiconductor trends and identify early-stage breakthroughs. Featured Universities & Research Institutes include BIT, CHIPX, GIICS, FYTRI, SCNU, SIEM, SUAT, SYSU, SZPU, SZU, THU, ZCST.

Showcased technologies include wafer-level thin-film lithium niobate photonic chips, large-scale hybrid integrated optical quantum computers, advanced packaging interface failure reliability solutions, glass substrates with through glass via (TGV) processes, and photosensitive polyimide packaging materials. The zone facilitates direct alignment between corporate technology needs, R&D capabilities, and investment resources – accelerating the journey from lab to market.

20+ Professional Forums: Exploring Industry Futures

IICIE 2026 will host over 20 high-quality conferences covering chip applications, semiconductor manufacturing, advanced packaging and testing, wide-bandgap semiconductors, intelligent manufacturing, and green facilities management. These forums bring together hundreds of global industry executives, leading experts, and senior analysts to address challenges, analyze technology trends, and share practical implementation insights – offering forward-looking guidance for the industry.

Among them, the 10th International Workshop on Advanced Patterning Solutions (IWAPS), as an annual academic and industry benchmark event, will focus on cutting-edge lithography technologies, driving innovation breakthroughs in advanced lithography processes. The Global Semiconductor Analysts Conference, themed on Navigating the Semiconductor New Era 2026-2030: Reshaping Industry Drivers, From Zero-Sum Competition to Collaborative Innovation, this conference brings together global industry intelligence to forecast the semiconductor industry's transformation pathways and growth drivers over the next five years, empowering high-quality collaborative development.

IICIE 2026 cordially invites global industry professionals to join us in Shenzhen this September, as we work together to build a thriving, collaborative semiconductor ecosystem. We look forward to welcoming you! > Get your free pass now