SHENZHEN, China – September 9, 2026 – The 2026 International Integrated Circuit Innovation Expo (IICIE 2026) officially opened today at the Shenzhen World Exhibition & Convention Center, marking a landmark moment for the global semiconductor industry. As a premier platform for the full integrated circuit (IC) ecosystem, IICIE 2026 showcases the entire value chain from IC design and wafer fabrication to packaging & testing, equipment, materials, and core parts.

In a strategic move that amplifies its reach and impact, IICIE 2026 is co-located with the 27th China International Optoelectronic Exposition (CIOE 2026) and the 23rd Shenzhen International Electronics & Embedded Expo (elexcon 2026). This powerful three-show convergence spans a record-breaking 340,000 square meters, hosts over 5,000 exhibitors and is expecting to attract more than 240,000 professional visitors from across the semiconductor, optoelectronics, and electronics sectors. A single badge grants access to all three events, delivering an unprecedented, cross-industry resource integration and business matching platform that effectively bridges the gap between chip design, manufacturing, photonics, and embedded systems.

A Full-Chain Showcase from Silicon to Systems

IICIE 2026 has assembled the entire semiconductor manufacturing chain within Halls 14-16, creating a comprehensive ecosystem that encompasses IDMs, fabless companies, foundries, and OSATs. The exhibition demonstrates the industry's full-spectrum capabilities, with leading players from each critical segment showcasing their latest innovations:

• Chip Design and Applications: The expo features a powerhouse of design houses, including BYD Semiconductor, CR Micro, iA Semiconductor, Montage Technology, Sanechips, and Unigroup Guoxin. These innovators are showcasing cutting-edge products for high-performance computing, automotive electronics, and consumer electronics, such as ultra-high-performance cloud security chips, memory expansion controllers, RISC-V CPUs, and 4nm automotive-grade intelligent driving chips.

• Foundry and OSAT Leaders: The critical manufacturing backbone is strongly represented by industry giants like GTA Semiconductor, HT-tech, Huahong Group, Nexchip, XMC, and Tongfu Microelectronics, who are demonstrating 12-inch wafers (28nm process technologies), silicon photonics wafers, and advanced 3D integration technologies.

• Equipment & Materials Ecosystem: IICIE 2026 highlights the industry's drive for self-reliance with a significant presence of key equipment and materials suppliers. Major equipment manufacturers such as ACM Research, Aspiring Semiconductor, Hwatsing, and Piotech are exhibiting alongside materials leaders like Anji Microelectronics, NSIG, and TankeBlue.

• Core Parts: The critical role of domestic components is on display, with leading suppliers like SKY, SIASUN Microelectronics, and VACREE showcasing essential parts like vacuum pumps, electrostatic chucks, and RF power supplies, which are vital for a robust and secure supply chain.

Hot Technology Zones and University Research Showcase

This year's IICIE is sharply focused on the industry's most dynamic growth areas. The show floor is abuzz with featured zones for chip applications, chips, and RISC-V ecosystem, where pioneers like C*Core Technology, Sophgo Technologies, and Xuantie are demonstrating their full-scenario RISC-V solutions. The dedicated IWAPS lithography Zone further unites metrology, inspection, and process control players to support the stable mass production of advanced lithography processes.

Furthermore, a dedicated University & Research Institute Zone has been established in Hall 16, bridging the gap between academic innovation and industrial application. Top-tier institutions, including School of Integrated Circuits, Tsinghua University; Shanghai Insititute of IC Materials; School of Integrated Circuits, Sun Yat-sen University; Guanzhou HKUST Fok Ying Tung Research Institute, and more, are presenting cutting-edge research such as wafer-level thin-film lithium niobate photonic chips and advanced packaging reliability solutions.

A Premier Forum for Global Industry Insights

Complementing the expansive exhibition, IICIE 2026 hosts over 20 high-level professional forums and conferences. Flagship events include the International Workshop on Advanced Patterning Solutions (IWAPS), focusing on the latest lithography technologies, and the Global Semiconductor Analyst Conference, themed "Navigating the New Semiconductor Era 2026-2030," which brings together global analysts to decode the industry's transformation path toward collaborative innovation. A key session will also feature Counterpoint Research discussing global automotive market trends and semiconductor demand, underscoring the expo's role as a knowledge hub.

The launch of IICIE as a full-chain platform could not come at a more critical time for the global semiconductor industry. With the surge in AI, HPC, and automotive applications, the need for a deeply integrated, cross-industry collaboration platform is paramount. IICIE 2026, in synergy with our partner shows, is that platform—where the entire ecosystem converges to drive innovation, tackle challenges, and forge the future of the IC industry.

IICIE 2026 runs from September 9-11. For more information, please visit the official IICIE website: https://iicieexpo.com/en/index.html

About IICIE

International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the entire ecosystem across chip & IC design, semiconductor manufacturing, packaging & testing equipment, core parts and material.

IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, fabless, fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other industries, delivering one-stop business connections, matchmaking, and industry exchanges.