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September 9-11, 2026
Shenzhen World Exhibition & Convention Center, China |
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| This year, IICIE 2026 will be co-located with the China International Optoelectronic Exposition (CIOE 2026) and the Shenzhen International Electronics & Embedded Expo (elexcon 2026), uniting three world-class exhibitions into a 320,000 sqm mega-platform featuring over 5,000 exhibitors and 240,000 professional visitors. For semiconductor and intelligent manufacturing professionals, this co-location delivers unmatched value:
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| 🔗 Source across the full value chain – from semiconductor materials and wafer fabrication to advanced packaging, precision optics, laser technologies, intelligent manufacturing and more.
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| ⚙️Access the broader equipment ecosystem – wafer fab and OSAT equipment, test and measurement systems, industrial vision, embedded systems, and semiconductor core parts.
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| 🌐Bridge three critical domains – semiconductor, optoelectronics, and embedded electronics, connecting silicon photonics, optical modules, CPO, and high-speed optical interconnect with the downstream computing and storage applications they enable.
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| The Future of Semiconductor Manufacturing: AI-Driven Intelligence Meets Precision Automation
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| AI is fundamentally transforming semiconductor manufacturing - moving the industry from isolated process optimization to intelligent, interconnected production ecosystems. |
| As advanced nodes, chiplet architectures, and heterogeneous integration continue to evolve, manufacturers are accelerating investments in AI-enabled automation, precision laser processing, and smart factory technologies. Intelligent manufacturing has evolved from a competitive advantage to an operational imperative, driving improvements in yield, productivity, and manufacturing flexibility across the entire value chain. |
| Three Critical Technology Drivers Reshaping the Industry |
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AI-Driven Process Control
AI-powered inspection, predictive maintenance, and adaptive process control are enabling fabs to improve yield rates, minimize downtime, and optimize manufacturing efficiency at unprecedented scales.
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Ultrafast Laser Precision Processing
Picosecond and femtosecond laser technologies deliver high-precision micromachining with minimal thermal impact, supporting advanced packaging, wafer processing, and precision component manufacturing.
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Machine Vision & Intelligent Automation
High-precision motion control, machine vision, and intelligent robotics are streamlining wafer handling, defect inspection, and automated production, laying the foundation for next-generation smart fabs.
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| Featured Exhibiting Products
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FANGLUI TECHNOLOGY
BOOTH: 15B107
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DJEL
BOOTH: 15B28 |
M-FINE
BOOTH: 14D45 |
HUAYU SEMICONDUCTOR
BOOTH: 14D70 |

ICP CVD Plasma Chemical Vapor Deposition Equipment |

Critical Dimension Scanning Electron Microscope |

C-molding Series |

Fully Automatic Packaging Machine |
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FEMTO&NANO
BOOTH: 15E59 |
SKYVERSE
BOOTH: 15A50 |
LEADER
BOOTH: 14A92 |
JUNHUA
BOOTH: 14C62 |

3-Axis Water-Jet Guided Laser Cutting Equipment FN-30X |

SWEETGUM |

Accretech Full-process Wafer Processing & Probing Equipment |

Board-level Vertical Plating Equipment (PLP, TGV) |
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WISDOM SEMITEC
BOOTH: 15A62 |
CCS
BOOTH: 15B09 |
SINOWON
BOOTH: 16B55 |
ZENGHE TECHNOLOGY
BOOTH: 14D10 |

D2W Hybrid Bonder – SIRIUS Series |

PFBR-600SW2-LLCF |

QVS Series Instant Measuring Machine |

9B-5/10 High-Precision Double-Side Lapping and Polishing Machine |
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| *The products are listed in no particular order. |
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| Concurrent Conferences
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| Date |
Conference |
Venue |
| September 11ᵗʰ - AM |
Advanced Optics and Intelligent Sensing Technology Forum |
1C, 2nd Floor, Hall 1 |
| September 9ᵗʰ - PM |
Laser Micro and Nano Processing Advanced Manufacturing Forum |
2C, 2nd Floor, Hall 2 |
| September 9ᵗʰ - PM |
Laser Technology Empowering Semiconductor Industry Manufacturing Forum |
2A, 2nd Floor, Hall 2 |
| September 9ᵗʰ - PM |
Laser Welding for Smart Manufacturing Innovation Application Forum |
Conference Room, Hall 4 |
| September 9ᵗʰ - PM |
Optical Semiconductor Inspection Technology Forum |
5B, 2nd Floor, Hall 5 |
| September 9ᵗʰ - PM |
Nanoimprint Manufacturing Technology Forum |
5C, 2nd Floor, Hall 5 |
| September 9ᵗʰ - PM |
Advanced Material Innovation Forum—Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging |
13A, 2nd Floor, Hall 13 |
| September 10ᵗʰ - PM |
2026 Intelligent Manufacturing Innovation and Development Conference |
14A, 2nd Floor, Hall 14 |
| September 9ᵗʰ - PM |
Core Semiconductor Manufacturing Equipment and Components Development Forum |
Conference Room, Hall 16 |
| September 9ᵗʰ - September 10ᵗʰ |
The 8th Embedded Technology Conference China 2026 |
Conference Room 1, Hall 16 |
| September 10ᵗʰ |
IWAPS International Workshop on Advanced Patterning Solutions |
Mangrove A, Second Floor, South Lobby |
| September 10ᵗʰ - AM |
Meta-optical & Micro-nano Optical Manufacturing Technology Forum |
5A, 2nd Floor, Hall 5 |
| September 10ᵗʰ - PM |
Optical Ultra-precision Manufacturing Forum |
5A, 2nd Floor, Hall 5 |
| September 10ᵗʰ |
Optics Vacuum Coating Forum |
Conference Room, Hall 7 |
| September 10ᵗʰ |
Advanced packaging & Testing Technology Forum —From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era |
14C, 2nd Floor, Hall 14 |
| September 10ᵗʰ |
Intelligent Industrial Control Empowering Automation Innovation Forum |
Conference Room, Hall 15 |
| September 10ᵗʰ |
Compound Semiconductor Advanced Packaging & SiC Embedded PCB Supply Chain Forum |
Conference Room, Hall 16 |
| September 11ᵗʰ |
IWAPS International Workshop on Advanced Patterning Solutions |
5AB, 2nd Floor, Hall 5;
6AB, 2nd Floor, Hall 6;
9AB, 2nd Floor, Hall 9; |
| September 11ᵗʰ - AM |
2nd Edge AI and Intelligent Control Technology Industry Forum |
Conference Room, Hall 15 |
| September 11ᵗʰ - AM |
Semiconductor Clean Utility & Energy Management Forum |
Conference Room, Hall 16 |
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| ABOUT IICIE |
| International Integrated Circuit Innovation Expo (IICIE 2026) is a premier global platform for the semiconductor ecosystem. Showcasing over 1,100 exhibitors that cover chip & IC design, semiconductor manufacturing & packaging equipment, materials and core parts. It connects global professionals from semiconductor manufacturing, consumer electronics, automotive, AI, optoelectronics and more, enabling innovation, business synergy and industry collaboration. |
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