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September 9-11, 2026 Shenzhen World Exhibition & Convention Center, China

ABOUT IICIE 2026 BROCHURE BOOTH APPLICATION REGISTER NOW

Competition in the semiconductor industry has evolved beyond cutting-edge process nodes. Driven by AI adoption, chiplet architectures, and 2.5D/3D integration technologies, the global advanced packaging market is projected to reach $47.9 billion in 2026, with a compound annual growth rate of 9.5% through 2030. This industry shift is fueling substantial value growth for semiconductor back-end manufacturing across OSAT, packaging equipment, testing, semiconductor materials, and precision manufacturing.

IICIE 2026 serves as the premier global platform for semiconductor back-end manufacturing, connecting the entire semiconductor ecosystem from IC design, wafer fabrication, packaging & testing equipment, materials, and core parts.

📅 Mark your calendar: September 9–11, 2026 | Shenzhen World Exhibition & Convention Center, China.

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Key Technology Trends Reshaping the Packaging & Testing Landscape

CPO (Co-Packaged Optics) – CPO technology is accelerating commercialization, with the potential to reduce network power consumption by up to 70% . This shift is driving new requirements for photonic-electronic integration, signal integrity, and system-level validation. HBM4 & 16‑Layer Stacking – HBM4 enters mass production in 2026, delivering higher bandwidth and improved power efficiency compared to previous generations. Early roadmaps and customer samples indicate 16-die/16-Hi configurations, though adoption timelines remain vendor-specific rather than industry-wide. Glass Substrates & Panel‑Level Packaging – Glass substrates offer superior CTE matching, lower signal loss, and support for larger panel sizes (up to 600mm×600mm) . The transition from CoWoS to CoPoS is driving demand for TGV (Through‑Glass Via) equipment, with HVM expected by 2028 .

IICIE 2026 brings these technology trends to life, showcasing real‑world solutions for CPO, HBM4, and glass substrate packaging.

Additionally, the concurrent conferences will dive into CoWoS‑to‑CoPoS evolution, 3.5D heterogeneous integration, panel‑level packaging, and hybrid bonding – bridging the gap between technology roadmaps and commercial deployment.

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Featured Exhibiting Products

CCS BOOTH: 15B09  CHANGYAO SEMICONDUCTOR BOOTH: 14A111  FEMTO&NANO BOOTH: 15E59 HUAYU SEMICONDUCTOR BOOTH: 14D70 PFBR-600SW2-LLCF Fully Automatic Vacuum Pressure Defoaming Oven 3-Axis Water-Jet Guided Laser Cutting Equipment FN-30X Fully Automatic Packaging Machine

JUNHUA BOOTH: 14C62  LEADER INNOVATION BOOTH: 14A92  MARANGONI BOOTH: 15A20  M-FINE BOOTH: 14D45  Board-level Vertical Plating Equipment (PLP, TGV) Koh Young True 3D Optical Inspection Equipment Marangoni Dryer C-molding Series

QUANTUM SCALE BOOTH: 14B06  RDS BOOTH: 15B77  SKYVERSE BOOTH: 15A50  ETRAN TECHNOLOGIES BOOTH: 15D18 AFM-NT20 Panel Level Packaging, PLP LATIFILM TONSOER Platform

*The products are listed in no particular order.

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Quick Access: · About IICIE   · Conference List    · Exhibitor/Product List    · VIP Buyer Program    · Delegation    · Download Center    · Traffic Guide    · Letter for Visa Application Let's stay in touch! For any questions or inquiries regarding IICIE 2026, feel free to scan the QR code and contact us directly via WhatsApp!

ABOUT IICIE International Integrated Circuit Innovation Expo (IICIE 2026) is a premier global platform for the semiconductor ecosystem. Showcasing over 1,100 exhibitors that cover chip & IC design, semiconductor manufacturing & packaging equipment, materials and core parts. It connects global professionals from semiconductor manufacturing, consumer electronics, automotive, AI, optoelectronics and more, enabling innovation, business synergy and industry collaboration. Follow IICIE #IICIE2026 www.iicieexpo.com/en

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