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1st Integrated Circuit Product and Application Collaborative Innovation Conference
Time:2026-09-10
Venue:Leadership Summit Area-Conference Room, Hall 16
Language:CN

Organizer:

IJIWEI, International Integrated Circuit Innovation Expo

The conference aims to foster synergistic interaction between future-oriented innovation industries and the IC industry. By bringing together upstream and downstream enterprises, experts, scholars, and research institutions across the industrial chain, the conference will establish a platform for in-depth exchange and collaboration. The goal is to jointly explore ways to optimize the synergy mechanism between the IC industry and downstream applications, thereby accelerating the transformation and application of technological innovation achievements.

Free Meeting Registration

Conference Agenda

1st Integrated Circuit Product and Application Collaborative Innovation Conference
TimeTopicsSpeakers
10:00-10:05Host Opening
10:05-10:15Leader's Address
Theme 1: Chip-Cloud
10:15-10:35Technological R&D and Computing Power Demands of End-Cloud Integrated Large ModelsZhipu / Alibaba Cloud / Baidu
10:35-10:55Chip-Cloud Synergy for the Localization of Large ModelsInspur / Sugon / H3C
10:55-11:15Computing Chip Innovation Driving Cloud-Native Application UpgradesMoore Threads / MetaX / Biren
Theme 2: Intelligent Vehicles and Embodied Intelligence
11:15-11:35Defining Smart Cockpit Embodied Experience and Demand Implementation
/ Adaptation and Integration of Cockpit Domain Control Systems and Chips
Great Wall Motor / Xiaomi / Huawei / Bosch
11:35-11:55Collaborative Innovation in Joint Drive and Motion Control of Humanoid RobotsUnitree / Zhiyuan Robotics
11:55-12:15Localization of Automotive-Grade Chips and Supply Chain SynergyNXP / Horizon / SiEngine
Lunch
Theme 3: Intelligent Terminals
14:00-14:20Multimodal Interaction Innovation in Intelligent Terminalsvivo / Xiaomi / Thunderbird / Rokid
14:20-14:40Chip-Device Innovation for AIPC in Office ScenariosLenovo / Honor / Great Wall
14:40-15:00Whole-Home Smart Ecosystem Architecture Design and Multi-Device CollaborationHaier Smart Home / Goermicro
15:00-15:20Unlocking Edge-Side AI Computing Power Under Low Power ConsumptionArm China / Unisoc
Theme 4: Industrial Intelligence
15:20-15:40Industrial Chip-Device Synergy for Digital Twin ImplementationHaier / Foxconn
15:40-16:00Practices in Improving Accuracy of Industrial Inspection EquipmentHikvision / Dahua Technology / SenseTime / Megvii
16:00-16:20Low-Latency and High-Reliability Implementation of Industrial Edge Chips and Automation TerminalsOmniVision / Southchip / Awinic / Fullhan
16:20-16:40Power Consumption Management and Computing Power Adaptation for Industrial Edge DevicesSG Micro / Silergy / Silan

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