Organizer:
IJIWEI, International Integrated Circuit Innovation Expo
The conference aims to foster synergistic interaction between future-oriented innovation industries and the IC industry. By bringing together upstream and downstream enterprises, experts, scholars, and research institutions across the industrial chain, the conference will establish a platform for in-depth exchange and collaboration. The goal is to jointly explore ways to optimize the synergy mechanism between the IC industry and downstream applications, thereby accelerating the transformation and application of technological innovation achievements.
| Time | Topics | Speakers |
|---|---|---|
| 10:00-10:05 | Host Opening | |
| 10:05-10:15 | Leader's Address | |
| Theme 1: Chip-Cloud | ||
| 10:15-10:35 | Technological R&D and Computing Power Demands of End-Cloud Integrated Large Models | Zhipu / Alibaba Cloud / Baidu |
| 10:35-10:55 | Chip-Cloud Synergy for the Localization of Large Models | Inspur / Sugon / H3C |
| 10:55-11:15 | Computing Chip Innovation Driving Cloud-Native Application Upgrades | Moore Threads / MetaX / Biren |
| Theme 2: Intelligent Vehicles and Embodied Intelligence | ||
| 11:15-11:35 | Defining Smart Cockpit Embodied Experience and Demand Implementation / Adaptation and Integration of Cockpit Domain Control Systems and Chips | Great Wall Motor / Xiaomi / Huawei / Bosch |
| 11:35-11:55 | Collaborative Innovation in Joint Drive and Motion Control of Humanoid Robots | Unitree / Zhiyuan Robotics |
| 11:55-12:15 | Localization of Automotive-Grade Chips and Supply Chain Synergy | NXP / Horizon / SiEngine |
| Lunch | ||
| Theme 3: Intelligent Terminals | ||
| 14:00-14:20 | Multimodal Interaction Innovation in Intelligent Terminals | vivo / Xiaomi / Thunderbird / Rokid |
| 14:20-14:40 | Chip-Device Innovation for AIPC in Office Scenarios | Lenovo / Honor / Great Wall |
| 14:40-15:00 | Whole-Home Smart Ecosystem Architecture Design and Multi-Device Collaboration | Haier Smart Home / Goermicro |
| 15:00-15:20 | Unlocking Edge-Side AI Computing Power Under Low Power Consumption | Arm China / Unisoc |
| Theme 4: Industrial Intelligence | ||
| 15:20-15:40 | Industrial Chip-Device Synergy for Digital Twin Implementation | Haier / Foxconn |
| 15:40-16:00 | Practices in Improving Accuracy of Industrial Inspection Equipment | Hikvision / Dahua Technology / SenseTime / Megvii |
| 16:00-16:20 | Low-Latency and High-Reliability Implementation of Industrial Edge Chips and Automation Terminals | OmniVision / Southchip / Awinic / Fullhan |
| 16:20-16:40 | Power Consumption Management and Computing Power Adaptation for Industrial Edge Devices | SG Micro / Silergy / Silan |