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1st China Integrated Circuit Innovation Investment Conference
Time:2026-09-09
Venue:14B, 2nd Floor, Hall 14
Language:CN

Organizers:
Integrated Circuit Investment Innovation Alliance, IJIWEI, International Integrated Circuit Innovation Expo

Global AI capacity expansion has become a definitive investment trend. The surge in large models has driven rigid demand for computing power, propelling computing chips, HBM, and advanced packaging into a period of significant value growth. With the chip value of a single AI server reaching 30 times that of a traditional server and the HBM market growing at over 60% annually, the semiconductor industry chain presents a rare structural investment opportunity.


On the domestic front, the 15th Five-Year Plan will continue to unleash policy dividends. AI-driven expansion highlights the investment value of domestic substitution in equipment, materials, and EDA, marking a critical period for capital-driven breakthroughs.


This conference, aligned with the theme “Cross-Sector Integration · Full-Chain Synergy,” will bring together top global enterprises, investment institutions, and experts to bridge industry and capital, analyze key trends, and help investors identify quality targets.

Free Meeting Registration

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