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2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Forum
Time:2026-09-09
Venue:Leadership Summit Area-Conference Room, Hall 16
Language:CN

Organizer:

IJIWEI, International Integrated Circuit Innovation Expo

The conference agenda includes opening ceremonies, keynote speeches, major ceremonial events, exhibition tours, and networking sessions. It will bring together top experts, scholars, and entrepreneurs from the integrated circuit industry both domestically and internationally to engage in in-depth discussions on technological, industrial, and market development trends. For the opening ceremony, relevant leaders from ministries, commissions, and local governments, as well as heads of industry associations and alliance organizations, are invited to deliver remarks. The keynote speeches will feature globally renowned scholars and leading enterprises across the industrial chain.

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Conference Agenda

2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Forum
TimeTopicsSpeakers
10:00-10:05Opening
10:05-10:25Leader’s Address
10:25-10:40Ceremony Session
IC Innovation Summit Forum
10:40-11:00AI Empowerment, Chip-Cloud Collaboration Driving Industrial InnovationAcademician / Expert
11:00-11:20Innovative Development of China's Semiconductor IndustryAcademician / Expert
11:20-11:40Global Industry Chain Synergy and Localization Development in ChinaIntel / Qualcomm
11:40-11:50Development and Trends of China's IC Design IndustryIndustry associations / alliances
11:50-12:10Development and Trends of China's IC Manufacturing and EquipmentIndustry associations / Research institutions
IC Innovation Summit Forum
14:00-14:20Innovative Development Trends in IC ManufacturingWingtech / CR Micro / Nexchip
14:20-14:40Innovative Development of Advanced PackagingTongfu Microelectronics / JCET / Huatian Technology / SJ Semiconductor
14:40-15:00Development Trends of the International Semiconductor Equipment IndustryASML / Applied Materials
15:00-15:20Innovative Development of Domestic Equipment and MaterialsACM Research / AMEC
15:20-15:40Development Trends of International Semiconductor MaterialsMerck / National Silicon Industry Group
15:40-16:00Innovative Development of Semiconductor Equipment ComponentsFortrend / Huazhuo Precision
16:00-16:40Roundtable Forum:
Theme: Chip-Chain Synergy, Manufacturing-Driven
Panelists: MetaX, Hua Hong Group, JCET, Yangtze Memory Technologies, Hwatsing, Jiangfeng Electronics, etc.
Conclusion of the Conference

Other 2026 Conference and Event

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—Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging
Core Semiconductor Manufacturing Equipment and Components Development Forum
Advanced Packaging & Testing Technology Forum
— From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era
Machine Vision and Intelligent Manufacturing Innovation Forum
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-- From Computing Power to Execution, Building Embodied Intelligence Systems
2026 Intelligent Manufacturing Innovation and Development Conference
Intelligent Industrial Control Empowering Automation Innovation ForumGreen Manufacturing Innovation Forum
The 8th Fudan Micro Cup Electronic Design Contest Awards Ceremony1st China University Students AI-Enabled Innovation and Entrepreneurship Competition and Award Ceremony
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