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2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Summit
Time:2026-09-09
Venue:Leadership Summit Area-Conference Room, Hall 14
Language:CN

Organizer:

IJIWEI, International Integrated Circuit Innovation Expo (IICIE)

The conference agenda includes opening ceremonies, keynote speeches, major ceremonial events, exhibition tours, and networking sessions. It will bring together top experts, scholars, and entrepreneurs from the integrated circuit industry both domestically and internationally to engage in in-depth discussions on technological, industrial, and market development trends. For the opening ceremony, relevant leaders from ministries, commissions, and local governments, as well as heads of industry associations and alliance organizations, are invited to deliver remarks. The keynote speeches will feature globally renowned scholars and leading enterprises across the industrial chain.

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Conference Agenda

2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Summit
TimeTopicsSpeakers
International Integrated Circuit Innovation Expo Opening Ceremony
10:00-10:05Opening Remarks by Guest SpeakerWei Chen, President of Guangdong Integrated Circuit Industry Association.
10:05-10:25Address by Academicians / Experts
10:25-10:30Opening Ceremony
Morning session
10:30-10:50TBCPeng Bai, Chairman of the Board & President, HUAHONG GROUP.
10:50-11:10TBCLei Shi, Chairman, TONGFU MICROELECTRONICS.
11:10-11:30TBCShining Yang, Chairman, ICLEAGUE.
11:30-11:50TBCPu Meng, Chairman of Qualcomm China.
11:50-12:10Empowering Intelligent Computing EcosystemWeiliang Chen, Founder, Chairman and CEO, MetaX Integrated Circuits (Shanghai) Co., Ltd.
Afternoon session
14:00-14:20Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip PackagingZhaowei Jia, Process Vice President, ACM Research (Shanghai), Inc.
14:20-14:40The PostMoore's Law Era: Eastern Paradigm of AI Chip DesignWei Guo, VP, Shanghai Eastern Computing Technology Co., Ltd.
14:40-15:00TBCGUOXIN MICRO
15:00-15:20Opportunities for IC Material in China in the AI EraDr. Wei LI, Executive Vice President, National Silicon Industry Group.

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