Organizer:
IJIWEI, International Integrated Circuit Innovation Expo (IICIE)
The conference agenda includes opening ceremonies, keynote speeches, major ceremonial events, exhibition tours, and networking sessions. It will bring together top experts, scholars, and entrepreneurs from the integrated circuit industry both domestically and internationally to engage in in-depth discussions on technological, industrial, and market development trends. For the opening ceremony, relevant leaders from ministries, commissions, and local governments, as well as heads of industry associations and alliance organizations, are invited to deliver remarks. The keynote speeches will feature globally renowned scholars and leading enterprises across the industrial chain.
| Time | Topics | Speakers |
|---|---|---|
| International Integrated Circuit Innovation Expo Opening Ceremony | ||
| 10:15-10:20 | Opening Remarks | |
| 10:20-10:40 | Address | |
| 10:40-10:45 | Opening Ceremony | |
| Integrated Circuit Innovation Summit - Morning session Host: Wei Chen, President of Guangzhou Semiconductor Industry Association | ||
| 10:45-11:05 | Forge ahead with gratitude Advance with the momentum Cooperate for mutual success, To build a high-quality collaborative development ecosystem | Bill Shi Lei, Board chairman & CEO, TONGFU MICROELECTRONICS CO.,LTD. |
| 11:05-11:25 | Agentic EDA — From Intelligent Tools to Intelligent Design | Weiping Liu, Chairman, Beijing Empyrean Technology Co., Ltd. |
| 11:25-11:45 | Empowering Intelligent Computing Ecosystem | Weiliang Chen, Founder, Chairman and CEO, MetaX Integrated Circuits (Shanghai) Co., Ltd. |
| 11:45-12:05 | Optical-Empowered Computing · Accelerating the Compute Revolution | Holly Sun, CEO, XMC. |
| 12:05-12:25 | Agentic AI: Powering a New Growth Cycle for Semiconductors | Frank Meng, Chairman of Qualcomm China. |
| 12:25-12:45 | Semiconductor Metrology and Inspection Technology and Equipment — From Innovation to Breakthrough | Lu Chen, Chairman and General Manager, Skyverse Technology Co., Ltd. |
| Integrated Circuit Innovation Summit - Afternoon session Host TBC | ||
| 14:00-14:20 | Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip Packaging | Zhaowei Jia, Process Vice President, ACM Research (Shanghai), Inc. |
| 14:20-14:40 | IC Industry Innovation for Commercial Aerospace and Post-Moore Technologies | Jie Chen, Chairman, Unigroup Guoxin Microelectronics Co., Ltd. |
| 14:40-15:00 | The PostMoore's Law Era: Eastern Paradigm of AI Chip Design | Wei Guo, VP, Shanghai Eastern Computing Technology Co., Ltd. |
| 15:00-15:20 | Opportunities for IC Material in China in the AI Era | Dr. Wei LI, Executive Vice President, National Silicon Industry Group. |
| 15:20-15:40 | Status and Outlook of Electronic Specialty Gases for Integrated Circuits | Cheng Ding, Deputy General Manager, Peric Special Gases Co., Ltd. |
| 15:40-16:00 | System-Level Security Challenges and Emerging Industry Opportunities in the Age of AI Agents | Bo Pi, CTO, Goodix Technology. |
| 16:00-16:20 | The Agent Era: FPGA Industry Transformation and Value Reassessment Not to Be Overlooked | Jian Yu, Deputy General Manager, Shanghai Fudan Microelectronics Group Co., Ltd. |
| 16:20-16:40 | Empowered by the AI Wave: Innovative Industrialization of Semiconductor Materials and Components | Jerry Chen, Vice President, KONFOONG MATERIALS INTERNATIONAL CO., LTD. |
| 16:40 | Conclusion of the Conference | |
Board chairman & CEO, TONGFU MICROELECTRONICS CO.,LTD.
Chairman, Beijing Empyrean Technology Co., Ltd.
Founder, Chairman and CEO, MetaX Integrated Circuits (Shanghai) Co., Ltd.
Chairman of Qualcomm China.
Chairman and General Manager, Skyverse Technology Co., Ltd.
Process Vice President, ACM Research (Shanghai), Inc.
Chairman, Unigroup Guoxin Microelectronics Co., Ltd.
VP, Shanghai Eastern Computing Technology Co., Ltd.
Executive Vice President, National Silicon Industry Group.
Deputy General Manager, Peric Special Gases Co., Ltd.
CTO, Goodix Technology.
Deputy General Manager, Shanghai Fudan Microelectronics Group Co., Ltd.
Vice President, KONFOONG MATERIALS INTERNATIONAL CO., LTD.