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2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Summit (Finished)
Time:2026-09-09
Venue:Leadership Summit, Hall 14
Language:CN

Organizer:

IJIWEI, International Integrated Circuit Innovation Expo (IICIE)

The conference agenda includes opening ceremonies, keynote speeches, major ceremonial events, exhibition tours, and networking sessions. It will bring together top experts, scholars, and entrepreneurs from the integrated circuit industry both domestically and internationally to engage in in-depth discussions on technological, industrial, and market development trends. For the opening ceremony, relevant leaders from ministries, commissions, and local governments, as well as heads of industry associations and alliance organizations, are invited to deliver remarks. The keynote speeches will feature globally renowned scholars and leading enterprises across the industrial chain.

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Conference Agenda

2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Summit (Finished)
TimeTopicsSpeakers
International Integrated Circuit Innovation Expo Opening Ceremony
10:15-10:20Opening Remarks
10:20-10:40Address
10:40-10:45Opening Ceremony
Integrated Circuit Innovation Summit - Morning session
Host: Wei Chen, President of Guangzhou Semiconductor Industry Association
10:45-11:05Forge ahead with gratitude Advance with the momentum Cooperate for mutual success, To build a high-quality collaborative development ecosystemBill Shi Lei, Board chairman & CEO, TONGFU MICROELECTRONICS CO.,LTD.
11:05-11:25Agentic EDA — From Intelligent Tools to Intelligent DesignWeiping Liu, Chairman, Beijing Empyrean Technology Co., Ltd.
11:25-11:45Empowering Intelligent Computing EcosystemWeiliang Chen, Founder, Chairman and CEO, MetaX Integrated Circuits (Shanghai) Co., Ltd.
11:45-12:05Optical-Empowered Computing · Accelerating the Compute RevolutionHolly Sun, CEO, XMC.
12:05-12:25Agentic AI: Powering a New Growth Cycle for SemiconductorsFrank Meng, Chairman of Qualcomm China.
12:25-12:45Semiconductor Metrology and Inspection Technology and Equipment — From Innovation to BreakthroughLu Chen, Chairman and General Manager, Skyverse Technology Co., Ltd.
Integrated Circuit Innovation Summit - Afternoon session
Host TBC
14:00-14:20Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip PackagingZhaowei Jia, Process Vice President, ACM Research (Shanghai), Inc.
14:20-14:40IC Industry Innovation for Commercial Aerospace and Post-Moore TechnologiesJie Chen, Chairman, Unigroup Guoxin Microelectronics Co., Ltd.
14:40-15:00The PostMoore's Law Era: Eastern Paradigm of AI Chip DesignWei Guo, VP, Shanghai Eastern Computing Technology Co., Ltd.
15:00-15:20Opportunities for IC Material in China in the AI EraDr. Wei LI, Executive Vice President, National Silicon Industry Group.
15:20-15:40Status and Outlook of Electronic Specialty Gases for Integrated CircuitsCheng Ding, Deputy General Manager, Peric Special Gases Co., Ltd.
15:40-16:00System-Level Security Challenges and Emerging Industry Opportunities in the Age of AI AgentsBo Pi, CTO, Goodix Technology.
16:00-16:20The Agent Era: FPGA Industry Transformation and Value Reassessment Not to Be OverlookedJian Yu, Deputy General Manager, Shanghai Fudan Microelectronics Group Co., Ltd.
16:20-16:40Empowered by the AI Wave: Innovative Industrialization of Semiconductor Materials and ComponentsJerry Chen, Vice President, KONFOONG MATERIALS INTERNATIONAL CO., LTD.
16:40Conclusion of the Conference

Guest Introduction

Other 2026 Conference and Event (Finished)

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— From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era
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-- From Computing Power to Execution, Building Embodied Intelligence Systems
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Semiconductor Clean Utility & Energy Management Forum1st China University Students AI-Enabled Innovation and Entrepreneurship Competition and Award Ceremony
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