| Time | Topics | Speakers |
|---|
| 10:00-10:05 | Opening | |
| 10:05-10:25 | Advanced Packaging for AI: Evolution & Opportunities | Haitao Liu, TPM, HT-Tech. |
| 10:25-10:45 | Heterogeneous Integration Technology Drives the Innovative Development of 3D IC and 3D MEMS | Shaoping Li, Chief Expert, China Resources Microelectronics Limited. |
| 10:45-11:05 | From CoWoS to CoPoS: A New Paradigm for Quality Control in High-Volume Advanced Packaging Manufacturing | Shuai Yu, Director of Semiconductor Optics Business Division, Wuhan Jingce Electronic Group Co., Ltd. |
| 11:05-11:25 | The Application of Heterogeneous Bonding Technology and Wafer Bonding Equipment for Advanced Packaging | Shijie Ma, Technical expert, The 2nd Research Institute of China Technology Group Vorporation. |
| 11:25-11:45 | HBM&Chiplets in the Datacenter | V.P.Sampath, Founder, Bharath Semiconductor Society, Senior Member of IEEE. |
| Lunch Break |
| 13:30-13:50 | Application of Sapphire Carriers in Advanced Packaging | Sen Kang, Deputy General Manager, TDG Holding Co.,LTD. |
| 13:50-14:10 | Large-size GCP Glass-based Packaging Substrate Technology | Mingxin Wang, Vice President & Chief Strategy Officer, WG Tech. |
| 14:10-14:30 | Advanced Packaging and Bonding Technology in the Era of AI Computing Power | Chao Guo, Co-Founder & Vice General Manager, iSABers Group Co., Ltd. |
| 14:30-14:50 | Establishing China's Next-Gen One-Stop OSAT Platform: Advanced Packaging + Independent Third-Party Testing | Peng Xu, Director of Management & Operations Center, Zhejiang Centraway Micro Electronic Technology Co. Ltd. |
| 14:50-15:10 | Advanced Packaging Equipment Innovation and Industry Trends in the Computing Driven Era | Tianming Li, Deputy Sales Director, Capcon. |
| 15:10-15:30 | Microscale Electrical Characteristics, Carrier Behavior and Defect Characterization of SiC | Ivy, Principal Engineer of Material Analysis, Shenzhen Pinghu Laboratory. |
| 15:30-15:50 | Process Reliability Challenges and Improvement Strategies for Ultra-large-scale Chiplet Advanced Packaging | Hongbin Shi, Chief Expert of Electronic Packaging, Shanghai Awinic Technology Co., Ltd. |
| 15:50-16:10 | System Integration Design and Process Optimization of AI-driven 2.5D High-end Advanced Packaging | Star Wang, General Manager, Anji Haiwanxin Technology Co.,Ltd. |
| 16:10-16:30 | 3D Imaging Systems for Advanced Packaging and High-Density Interconnection | Yan Dong , Sales Director, Phasora3D Optical Imaging Co., Ltd. |
| 16:30-16:50 | Al Haimen, Pooling Efforts in Advanced Packaging to Build a Collaborative Innovation Highland for the Chiplet Industrial Chain | Yibing Wang, Member of the Standing Committee of the CPC Haimen District Committee, Director of the Publicity Department, Nantong City. |
