Semiconductor equipment and processes are the foundation of chip manufacturing, directly determining performance, yield, and cost, while serving as the bedrock for strategic industries such as AI and high-performance computing. Core precision components provide the physical carrier and functional foundation for advanced equipment.

With high technical barriers, component performance directly determines equipment stability and process boundaries. The global high-end market is dominated by U.S., Japan, and Europe. Bottlenecks in areas such as EUV lithography often trace back to constraints in critical component supply.

As the global semiconductor landscape transforms, China has achieved large-scale substitution in mature process equipment (28nm) and reached advanced levels in certain packaging and testing processes. However, challenges remain in advanced equipment and sub-3nm processes. Localization and technological
iteration is urgent. Breakthroughs in equipment depend on collaborative innovation with upstream core components.

This forum will focus on innovative technologies and trends in semiconductor equipment and components, explore pathways for localization and self-reliance, and promote synergistic development to enhance the overall competitiveness of the semiconductor industry chain.