International Integrated Circuit Innovation Exposition ( IICIE-2027 )

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Advanced Material Innovation Forum
— Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging (Finished)

Time：2026-09-09
Venue：13C, 2nd Floor, Hall 13
Language：CN

Organizer：

IJIWEI, International Integrated Circuit Innovation Expo (IICIE)

This forum focuses on the core bottlenecks of heterogeneous integration packaging amid the explosive growth of AI computing power. Taking innovative breakthroughs in key materials as the entry point, it brings together the strengths of industry, academia and research to tackle technical challenges and explore industrial trends collectively. The forum covers four core technical dimensions:

• Thermal Management

• Wafer Stacking

• Glass Substrate

• Opportunities at Mass Production

The forum aims to break down the industrial chain barriers between material R&D and packaging applications, providing technical references and collaboration platforms for breaking through the limits.

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Conference Agenda

Advanced Material Innovation Forum
— Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging (Finished)

Time	Topics	Speakers
14:00-14:05	Opening
14:05-14:25	The Evolution of Future Semiconductor Materials: How Compound Semiconductors Empower the Al computing Era	Victor Veliadis, Executive Director & CTO, PowerAmerica.
14:25-14:45	Polymer-Based Advanced Packaging Materials and Their Applications in Co-packaged Optics	Pengli Zhu, Vice President, Shenzhen Institute of Advanced Electronic Materials.
14:45-15:05	Hybrid Bonding Technology Presentation and ECP Solutions from Anji	Cruise Tang, Product Manager, Anji Microelectronic Technology (Shanghai) Co., Ltd.
15:05-15:25	From IGBT to SiC/GaN: Interconnection and Thermal Dissipation Breakthroughs with Formic Acid Solder Paste and Sintering Pastes in AI High-Power Packaging	Hai Feng, Project Director of Formic Acid Solder Paste Project, Shenzhen EarlysunTechnology Co.,Ltd.
15:25-15:45	From Mobile SiP to Photonics: Enabling High-yield with Heraeus Advanced Packaging Fine-pitch Solder Materials	Hanwen Zhang, Global Product Manager, Advanced Packaging, Heraeus Materials Technology Shanghai Ltd.
15:45-16:05	Fabrication and Integration Technologies of Two-Dimensional Transistors for the Post-Moore Era	He Tian, Tenured Associate Professor & Deputy Director of the Institute at the School of Integrated Circuits, Tsinghua University.
16:05-16:25	Prospects for the Development of Mid‑to‑High‑End Semiconductor Photomasks	Frank Tao, Vice President, Shenzhen Qingyi Microelectronics Co.,Ltd.
16:25-16:45	Breaking the Thermal-Budget Bottleneck in High-Density Interconnects: Low-Temperature Cu / SiO₂ Hybrid Bonding Materials and Process Validation	Yonghan Zhou, City University of Hong Kong.

Guest Introduction

Victor Veliadis

Executive Director & CTO, PowerAmerica.
Pengli Zhu

Vice President, Shenzhen Institute of Advanced Electronic Materials.
Cruise Tang

Product Manager, Anji Microelectronic Technology (Shanghai) Co., Ltd.
Hai Feng

Project Director of Formic Acid Solder Paste Project, Shenzhen EarlysunTechnology Co.,Ltd.
Hanwen Zhang

Global Product Manager, Advanced Packaging, Heraeus Materials Technology Shanghai Ltd.
He Tian

Tenured Associate Professor & Deputy Director of the Institute at the School of Integrated Circuits, Tsinghua University.
Frank Tao

Vice President, Shenzhen Qingyi Microelectronics Co.,Ltd.
Yonghan Zhou

City University of Hong Kong.

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