This forum focuses on the core bottlenecks of heterogeneous integration packaging amid the explosive growth of AI computing power. Taking innovative breakthroughs in key materials as the entry point, it brings together the strengths of industry, academia and research to tackle technical challenges and explore industrial trends collectively. The forum covers four core technical dimensions:

• Thermal Management 

• Wafer Stacking

• Glass Substrate

• Opportunities at Mass Production

The forum aims to break down the industrial chain barriers between material R&D and packaging applications, providing technical references and collaboration platforms for breaking through the limits.