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Advanced Material Innovation Forum
—Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging
Time：2026-09-09
Venue：13C, 2nd Floor, Hall 13
Language：CN

Organizer：

IJIWEI, International Integrated Circuit Innovation Expo (IICIE)

This forum focuses on the core bottlenecks of heterogeneous integration packaging amid the explosive growth of AI computing power. Taking innovative breakthroughs in key materials as the entry point, it brings together the strengths of industry, academia and research to tackle technical challenges and explore industrial trends collectively. The forum covers four core technical dimensions:


• Thermal Management 

• Wafer Stacking

• Glass Substrate

• Opportunities at Mass Production


The forum aims to break down the industrial chain barriers between material R&D and packaging applications, providing technical references and collaboration platforms for breaking through the limits.

Free Conference Registration

Conference Agenda

Advanced Material Innovation Forum
—Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging
TimeTopicsSpeakers
14:00-14:05Opening
14:05-14:25Evolution of Future Semiconductor Materials: How Compound Semiconductors Empower the AI Computing EraVictor Veliadis, Executive Director & CTO, PowerAmerica.
14:25-14:45Polymer-Based Advanced Packaging Materials and Their Applications in Co--packaged OpticsPengli Zhu, Vice President, Shenzhen Institute of Advanced Electronic Materials.
14:45-15:05Hybrid bonding technology presentation and ECP solutions from AnjiCruise Tang, Product Manager, Anji Microelectronic Technology (Shanghai) Co., Ltd.
15:05-15:25TBCEarlysun
15:45-16:05From Mobile SiP to Photonics: Enabling high-yield with Heraeus advanced packaging fine-pitch solder materialsHanwen Zhang, Global Product Manager, Advanced Packaging, Heraeus Materials Technology Shanghai Ltd.
15:40-16:00Fabrication and Integration Technologies of Two-Dimensional Transistors for the Post-Moore EraHe Tian, Tenured Associate Professor & Member of the Party Committee & Deputy Director of the Institute at the School of Integrated Circuits, Tsinghua University.
16:05-16:25TBCShenzhen Qingyi Photomask Limited.
16:25-16:45Breaking the Thermal-Budget Bottleneck in High-Density Interconnects: Low-Temperature Cu / SiO₂ Hybrid Bonding Materials and Process ValidationYonghan Zhou, City University of Hong Kong.

Guest Introduction

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