Co-packaged optics (CPO) integrates optical devices, driver chips, and ASICs onto a single substrate, significantly shortening signal transmission distances, enhancing integration, and reducing power consumption. According to LightCounting, CPO ports will account for nearly 30% of total 800G and 1.6T ports by 2027. Meanwhile, silicon-based heterogeneous optoelectronic integration combines silicon and photonics, overcoming speed and bandwidth limitations while excelling in power efficiency, integration, and cost control—with broad applications in data centers, optical communications, and quantum computing.

However, CPO also faces challenges in material compatibility, thermal management, precision processing, and packaging reliability. This conference will bring together
experts from global research institutions, enterprises, and government experts
to explore the latest technologies, applications, and future directions of silicon-based optoelectronic integration and CPO technology.