Home > Searchforconference

Global Semiconductor Analysts Conference
2026-2030 : A New Era of Navigation Semiconductors
-Reshaping industrial driving forces and moving to collaborative innovation
Time:2026-09-11
Venue:13B&13C 2nd Floor, Hall 13
Language:CN

This forum anchors on the 2025-2030 global semiconductor market evolution, focusing on key trends and challenges to offer global insights and strategic perspective for industry players, investors and executives.


Across three days, the forum centers on market cycles & supply chains, emerging technologies & capacity layout, and industry integration & the future in turn:

  • Day 1 delves into super cycle balance and capacity relocation issues, SE Asia/India’s packaging, testing & design opportunities, and AI-enabled EDA tools. 

  • Day 2 assesses generative AI, cloud custom chips’ challenges to traditional players and edge AI trends, tracks new wafer fab progress in the US, Europe and Japan, and highlights PLP and software-defined automotive tech breakthroughs. 

  • Day 3 covers global semiconductor M&A waves, the rise of new capital, and the long-term impacts and layout opportunities of glass substrates and quantum computing, with cutting-edge insights empowering decision-making and future industry growth.

Other 2026 Conference and Event

2026 International Integrated Circuit Innovation Expo Opening Ceremony & Integrated Circuit Innovation Forum1st Integrated Circuit Product and Application Collaborative Innovation Conference
1st China Integrated Circuit Innovation Investment ConferenceEDA and IP Electronic Design Forum
2026 China RISC-V Ecosystem Conference3rd AI-Enabled Consumer Electronics Innovation Forum
Secure Defense with Intelligence -- AI Security Innovation Application and Industry Integration ConferenceEdge AI Chip Power: 2026 Smart Terminal Chip Ecosystem Summit
Source of Intelligent Computing: 2026 Chip Computing Power Innovation Summit2nd Edge AI and Intelligent Control Technology Industry Forum
2nd CPO & Heterogeneous Integration Technology SymposiumCompound Empowerment, Leading the Future: Compound Semiconductor Innovation and New Era of Power Electronics
Advanced Material Innovation Forum
—Breaking Through the Limits - Key Materials for AI Heterogeneous Integration Packaging
Core Semiconductor Manufacturing Equipment and Components Development Forum
Advanced Packaging & Testing Technology Forum
— From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era
Machine Vision and Intelligent Manufacturing Innovation Forum
2026 Embodied Intelligence Industry Conference
-- From Computing Power to Execution, Building Embodied Intelligence Systems
2026 Intelligent Manufacturing Innovation and Development Conference
Intelligent Industrial Control Empowering Automation Innovation ForumGreen Manufacturing Innovation Forum
The 8th Fudan Micro Cup Electronic Design Contest Awards Ceremony1st China University Students AI-Enabled Innovation and Entrepreneurship Competition and Award Ceremony
X