Organizer:
gongkong, International Integrated Circuit Innovation Expo (IICIE)
With continuous breakthroughs in large models and AI technology, every link—from computing chips, sensors, and real-time communication networks to motion control systems, actuators, and complete machine design—directly impacts the practical deployment of embodied robots.
Against this backdrop, the conference adopts a “from chip to body” perspective, systematically reviewing the key links from core technologies to industrial application of embodied intelligence, building a platform for exchange and collaboration across the upstream and downstream of the industry chain, and advancing embodied intelligence from the lab to large-scale application.
Conference Highlights:
1.Bringing “AI Topics” Back to “System Engineering” – Focusing on the Industrialization Path of Embodied Intelligence
2.Building an Industry Dialogue Platform for “Chip–System–Complete Machine”
3.Focusing on Real-World Application Scenarios – Exploring the First Landing Industries for Embodied Intelligence
4.Systematically Analyzing the Embodied Robot Supply Chain – Identifying Key Pain Points and Bottlenecks
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